Optical Package Via Light-Absorption Warpage
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Solution Overview
Problem
Conventional optical packages with Time of Flight (ToF) sensors are too thick and suffer from substrate warpage due to coefficient of thermal expansion (CTE) mismatch, making them unsuitable for thin applications.
Innovation Solution
The optical package structure incorporates a substrate with a via and light-absorption material, along with an emitter and detector, where the light-absorption material is disposed on the substrate's surface defined by the via, and light-blocking structures surround the emitter and detector to prevent undesired light, reducing thickness and improving sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple materials with different characteristics are applied in the optical package, then functional requirements are met, but substrate warpage is induced due to CTE mismatch
Solution Approach 1:
The patent uses a single substrate material (glass or ceramic) throughout the package structure, eliminating CTE mismatch between different substrate materials. The light-blocking layer is applied only where needed rather than using multiple structural materials, maintaining material homogeneity while meeting functional requirements.
Solution Approach 2:
The patent combines a glass or ceramic substrate with a light-blocking material layer to create a composite structure that leverages the thermal stability of glass/ceramic substrates while adding light-blocking functionality through a specialized material layer, avoiding the need for multiple structural materials with different CTEs.
2Device complexity
If traditional optical package structure is used, then all necessary components are included, but thickness is too large (at least 1 mm)
Solution Approach 1:
The patent extracts and eliminates the separate lid component from the traditional optical package structure. The lid is integrated into the substrate design, and the light-blocking functionality is achieved through a deposited layer rather than a separate component, significantly reducing overall package thickness.
Solution Approach 2:
The patent merges the substrate and lid functions into a single integrated structure. The light-blocking layer is combined with the substrate assembly rather than being a separate component, and electrical connections are integrated into the substrate, reducing the number of discrete parts and overall thickness.
3Measurement precision
If light-blocking structures are added to prevent undesired light, then sensitivity is enhanced, but device complexity increases
Solution Approach 1:
The substrate structure itself provides light-blocking functionality through integrated light-blocking layers and via structures, eliminating the need for separate light-blocking components. The package structure serves multiple functions including structural support, electrical connection, and optical management simultaneously.
Solution Approach 2:
The light-blocking layer serves multiple functions: it blocks undesired light from reaching detectors, provides structural integration with the substrate, and enables compact packaging. The via structures simultaneously provide electrical connections and light-blocking pathways, reducing the need for additional components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the thickness of the optical package, minimizes substrate warpage, and enhances sensitivity by optimizing light reception, addressing the limitations of traditional optical packages.
Implementation Method 1
a light-absorption material... to prevent undesired light
Data Source
AI summary
An optical package structure includes a substrate, an emitter, a first detector and a light-absorption material. The substrate has a first surface and a second surface opposite to the first surface, the substrate includes a via defining a third surface extending from the first surface to the second surface. The emitter is disposed on the first surface of the substrate. The first detector is disposed on the first surface and aligned with the via of the substrate. The light-absorption material is disposed on the third surface of the substrate.