Optical Communication Package Via Layout for Shorter Signal Paths
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Solution Overview
Problem
In optical communication systems, the use of long bonding wires in photonic-electronic hybrid package structures leads to decreased transmission speed and increased power consumption, and the manufacturing of through silicon via (TSV) technology is challenging due to the multi-stage heating process that can damage the via structure.
Innovation Solution
An optical communication package structure is designed with a via structure and a redistribution structure that are electrically connected, allowing for a shorter electric transmission path and reducing power consumption, while the manufacturing method forms the via structure after the conductive structure to prevent damage from the multi-stage heating process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If wire bonding is used for electrical connection in photonic-electronic hybrid package structure, then connection is achieved, but transmission speed decreases and power consumption increases due to long bonding wire length
Solution Approach 1:
The patent transitions from horizontal wire bonding to vertical electrical connection through via structures that extend through the substrate thickness direction. This dimensional change enables direct vertical pathways between optical and electrical devices, eliminating the need for long horizontal bonding wires and thereby improving transmission speed while reducing connection length.
Solution Approach 2:
The patent introduces via structures filled with conductive material as intermediary elements that provide direct electrical pathways through the substrate. These via structures act as mediators between optical devices and electrical devices, replacing the need for long bonding wires and enabling shorter, more efficient electrical connections.
2Ease of manufacture
If via structure is formed before conductive structure in multi-stage heating process, then through hole is created, but via structure is damaged by subsequent heating processes
Solution Approach 1:
The patent inverts the conventional manufacturing sequence by forming the via structures after the conductive structure is already in place. This reversal protects the via structures from damage during the multi-stage heating process, as the conductive structure serves as a protective layer that prevents deformation of the via structures during subsequent heating steps.
Solution Approach 2:
The patent performs preliminary formation of the conductive structure before creating the via structures. This preliminary action ensures that the conductive structure is already established and can protect the subsequently formed via structures from damage during heating processes, thereby improving via structure integrity and manufacturing yield.
Data Source
AI summary
An optical communication package structure includes a wiring structure, at least one via structure, a redistribution structure, at least one optical device and at least one electrical device. The wiring structure includes a main portion and a conductive structure disposed on an upper surface of the main portion. The main portion defines at least one through hole extending through the main portion. The via structure is disposed in the at least one through hole of the main portion and electrically connected to the conductive structure. The redistribution structure is disposed on a lower surface of the main portion and electrically connected to the via structure. The optical device is disposed adjacent to the upper surface of the main portion and electrically connected to the conductive structure. The electrical device is disposed on and electrically connected to the conductive structure.