Optical-Electronic Semiconductor Package With Waveguide Connector
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Solution Overview
Problem
The increasing demand for miniaturization and speed in electronic devices necessitates the transition from metal line signal transmission to optical signal transmission, requiring an efficient integration of optical and electronic integrated circuits in semiconductor packages.
Innovation Solution
A semiconductor package design incorporating an optical integrated circuit with a coupler, an electronic integrated circuit, a transfer structure, and guide structures connected by an adhesive member with waveguide portions, allowing for high-bandwidth data transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If optical signal transmission is implemented to increase data transmission speed and bandwidth, then data transmission capability is improved, but device complexity increases due to integration of optical and electronic circuits
Solution Approach 1:
The patent combines optical integrated circuits and electronic integrated circuits into a single semiconductor package, merging optical signal transmission capabilities with electronic circuit functionality. The optical circuit includes waveguides, couplers, and optical sources integrated with electronic components on the same substrate, achieving unified optical-electronic integration that improves data transmission speed while managing complexity through consolidation.
Solution Approach 2:
The semiconductor package structure serves multiple functions simultaneously: it provides electrical connections through solder balls and conductive vias, optical signal transmission through waveguides and couplers, and mechanical support through the substrate. This multi-functionality allows a single integrated structure to handle both electrical and optical signal processing, improving overall system performance.
2Volume of moving object
If miniaturization is pursued to reduce device size, then device dimensions are reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs a nested structure where the optical circuit is integrated within the electronic circuit substrate. The waveguides are formed within the substrate layers, couplers are positioned at specific locations, and connection structures are embedded within the package. This nesting approach minimizes the overall package volume while maintaining functional integrity through precise layer-by-layer integration.
Solution Approach 2:
The patent utilizes three-dimensional integration by forming conductive vias that extend vertically through substrate layers, and by positioning optical and electronic components at different height levels. This vertical dimensionality allows compact packaging by stacking functional layers, reducing the horizontal footprint while maintaining manufacturing feasibility through standardized vias and layered structures.
3Strength
If connection structures are made more robust to prevent damage, then connection strength is improved, but electrical characteristics may deteriorate due to increased material layers
Solution Approach 1:
The connection structures utilize composite material systems combining solder balls (Sn-Pb or Sn-Ag-Cu alloy), conductive adhesive layers, and metallic trace patterns. This composite approach provides both mechanical strength for robust connections and controlled electrical conductivity. The layered composite structure allows optimization of each material's properties to simultaneously achieve connection strength and electrical performance.
Solution Approach 2:
The patent applies different material properties and structural configurations at different locations: solder balls provide mechanical strength and electrical connection at contact points, while thin conductive trace patterns provide electrical pathways with minimal resistance in critical signal regions. This local optimization ensures that each region of the connection structure performs its specific function optimally, maintaining electrical characteristics while providing robust mechanical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design facilitates efficient optical signal transmission and reduces the risk of connection damage through a detachable connector system, enhancing the semiconductor package's electrical characteristics and data transmission capabilities.
Implementation Method 1
the adhesive member includes a waveguide portion between sidewalls of the guide structures that face each other, and the waveguide portion is connected to the transfer structure
Data Source
AI summary
A semiconductor package may include an optical integrated circuit including a coupler, an electronic integrated circuit connected to the optical integrated circuit, a transfer structure in contact with an upper surface of the optical integrated circuit, and a connection on the transfer structure. The connection may guide structures extending in a first direction, and spaced apart from each other in a second direction perpendicular to the first direction, an adhesive member between the guide structures, and a connection portion at least partially surrounded by the adhesive member. The adhesive member may include a waveguide portion between sidewalls of the guide structures that face each other, and the waveguide portion may be connected to the adhesive member.