Optical Packaging Structure with Curved Lens for Wide Emission Angle
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Solution Overview
Problem
Conventional optical packaging structures with LEDs suffer from inadequate light emission angles and large size, resulting in poor light output effects.
Innovation Solution
The optical packaging structure incorporates a light-emitting chip, a packaging layer, a fluorescent layer, a lens structure with a curved surface, and a reflecting layer, which cooperatively refract and reflect light to increase the emission angle and reduce size, enhancing the optical effect and packaging density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional CSP or NCSP package structure is used, then the package structure can be compact, but the light emission angle is insufficient and light output effect is poor
Solution Approach 1:
The patent divides the optical packaging into distinct functional layers: a light-emitting chip layer, a fluorescent layer, a lens structure, and a reflecting layer. Each layer performs a specific optical function, allowing independent optimization of light emission angle and intensity without compromising overall package compactness.
Solution Approach 2:
The patent introduces a vertically stacked multi-layer configuration instead of planar arrangement. By utilizing the vertical dimension with the lens structure positioned above the fluorescent layer and the reflecting layer at the bottom, the design achieves wide light emission angles while maintaining a compact footprint area.
2Device complexity
If conventional optical packaging structure is used, then the structure is simple, but the size of the package structure is large
Solution Approach 1:
The patent implements a nested vertical stacking arrangement where the light-emitting chip is positioned above the reflecting layer, the fluorescent layer surrounds the chip, and the lens structure sits atop the fluorescent layer. This nested configuration maximizes space utilization and achieves compact packaging while maintaining structural simplicity through straightforward vertical assembly.
3Ease of manufacture
If conventional packaging structure is used, then manufacturing is simple, but light emission efficiency is insufficient
Solution Approach 1:
The patent combines multiple optical functions into an integrated vertical stack: the reflecting layer redirects downward light upward, the fluorescent layer converts light wavelengths, and the lens structure focuses and directs the emitted light. This merged multi-functional design improves light emission efficiency while maintaining manufacturing simplicity through a single integrated package structure that can be assembled in one process sequence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves light emission efficiency by directing light to sidewalls, reduces the overall size of the packaging structure, and increases packaging density, resulting in a more effective and compact backlight module.
Implementation Method 1
The lens structure (5) and the reflecting layer (7) can cooperatively reflect the light from the light-emitting chip (2) and change a travelling direction of the light
Implementation Method 2
The lens structure (5) and the reflecting layer (7) can cooperatively reflect the light from the light-emitting chip (2) and change a travelling direction of the light
Data Source
AI summary
The present disclosure provides an optical packaging structure and a backlight module with the optical packaging structure. The optical packaging structure includes a light-emitting chip, a packaging layer, a fluorescent layer, a lens structure, and a reflecting layer. The light-emitting chip includes a light-emitting surface, a connecting surface, and a side surface. The packaging layer covers the light-emitting surface and the first side surface. The connecting surface is exposed from the packaging layer. The fluorescent layer is disposed on the packaging layer, and covers on the light-emitting surface and the first side surface. The lens structure is disposed on a top surface of the fluorescent layer. A surface of the lens structure is recessed towards the light-emitting chip to form a curved surface. The reflecting layer is disposed on the curved surface.