Optical Assembly Packaging Structure with Segmented Thermal Management
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Solution Overview
Problem
Existing optical component packaging structures face high power consumption due to heat dissipation issues, as thermoelectric coolers (TECs) absorb and dissipate heat within the same sealed environment, leading to increased temperature and reduced precision of optical transmitters.
Innovation Solution
The optical component packaging structure features a cooler with a cooling plate and a heat dissipation plate in separate spaces, where the cooling plate is inside the cavity and the heat dissipation plate protrudes outside, connected via a conductive body, with an insulation layer on the sealing cover to reduce external heat ingress and enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the TEC is placed inside the packaging housing (TO-CAN or XMD), then the optical transmitter can be cooled, but the heat dissipation phenomenon causes an increase in temperature of the packaging housing and inside the housing, increasing the cooling burden and power consumption of the TEC
Solution Approach 1:
The patent divides the housing into two separate spaces: a first space containing the optical transmitter and TEC for cooling, and a second space for heat dissipation. This segmentation allows the cooling function to be isolated from the heat dissipation function, preventing heat accumulation in the optical component space while providing a dedicated pathway for heat removal, thereby reducing the continuous cooling burden and power consumption of the TEC
Solution Approach 2:
The patent extracts the heat dissipation function from the sealed housing environment by providing a through-hole that extends from the first space to the second space. This allows heat to be taken out of the optical component environment and dissipated in a separate space, preventing heat buildup that would otherwise increase the cooling burden and power consumption of the TEC
2Temperature
If the TEC is placed inside the packaging housing, then cooling function is provided, but the heat dissipation causes increased temperature inside the housing affecting precision of the optical transmitter
Solution Approach 1:
The patent segments the housing into a first space for the optical transmitter and a second space for heat dissipation, separated by a wall with a through-hole. This segmentation ensures that heat generated by the optical transmitter is removed through the through-hole into the second space, maintaining a stable, cool temperature environment in the first space and thereby preserving the precision of the optical transmitter
Solution Approach 2:
The through-hole acts as an intermediary pathway that allows heat to transfer from the first space (optical transmitter environment) to the second space (heat dissipation environment). This intermediary structure enables heat removal without direct exposure of the optical transmitter to hot environments, maintaining temperature stability and precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces power consumption and maintains precision by separating heat absorption and dissipation, preventing temperature increases within the cavity and improving heat dissipation efficiency.
Implementation Method 1
The Peltier effect is a phenomenon that when a direct current passes through a galvanic couple formed by two types of semiconductor materials, one end of the galvanic couple absorbs heat, and the other end dissipates heat
Implementation Method 2
a conductive connection body connecting the cooling plate and the heat dissipation plate
Data Source
Figure 1~2
Figure 3
Figure 4~5
AI summary
An optical component packaging structure (400), an optical component, an optical module (200), and a related apparatus and system are disclosed. The optical component packaging structure (400) includes a base (10), a sealing cover (30), and a cooler (20). The base (10) includes a mounting surface (11) and a back surface (12) that faces a direction opposite to that faced by the mounting surface (11). The cooler (20) includes a cooling plate (21), a heat dissipation plate (22) disposed opposite to the cooling plate (21), and a conductive connection body (23) connecting the cooling plate (21) and the heat dissipation plate (22). The cooling plate (21) includes a cooling surface (211). The cooler (20) is partially built in the base (10). The cooling plate (21) faces a direction the same as the mounting surface (11). The sealing cover (30) covers the mounting surface (11), and the sealing cover (30) and the mounting surface (11) form a sealing cavity. The cooling surface (211) is located inside the sealing cavity. The heat dissipation plate (22) protrudes from the back surface (12) and is sealedly connected to the base (10).