Optical Patch Cord Thermal Stress Relief
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Solution Overview
Problem
The existing manufacturing process of optical patch cords often results in residual mechanical stress, leading to shrink-back issues due to the inherent mechanical stress created during the manufacturing of the jacket, which is not fully relieved by the curing process, causing exposure of optical fibers and complications during severe weather or wear and tear.
Innovation Solution
A thermal treatment apparatus and method that includes a first passage way for the patch cord, a second passage way for the tracer, and at least one roller in a heated area to relieve stress by applying surface pressure, along with a bonding point where the tracer is surface bonded to the patch cord, using a bonding agent to assist bonding, and a reeling wheel for collecting and pulling the patch cord to reduce shrink-back.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional manufacturing process is used to create patch cords with jackets, then production efficiency is maintained, but residual mechanical stress remains in the jacket causing shrink-back
Solution Approach 1:
The patent applies thermal treatment to the patch cord jacket before final assembly and curing. By pre-relieving mechanical stress through controlled heating and rolling in the molten jacket material stage, the system prevents shrink-back issues before they occur during subsequent cooling and solidification, rather than attempting to fix them after manufacturing
Solution Approach 2:
The patent changes the temperature parameter of the jacket material to a molten state during the stress-relieving process. By heating the jacket material above its melting point and then controlled cooling, the mechanical stress is relieved through phase transition, transforming the material properties to enable stress relaxation without permanent deformation
2Reliability
If thermal treatment is applied to relieve mechanical stress, then shrink-back is reduced, but additional manufacturing steps and time are required
Solution Approach 1:
The patent combines the thermal stress-relieving process with the existing jacket formation and curing processes. The thermal treatment is integrated into the molten jacket material stage, where the same heating and rolling mechanisms serve both to form the jacket and to relieve mechanical stress, eliminating the need for separate stress-relief equipment and steps
3Ease of operation
If surface bonding is used to attach tracers to patch cords, then identification capability is improved, but bonding quality deteriorates due to residual stress
Solution Approach 1:
The patent performs thermal stress relief on the jacket material before the surface bonding operation. By relieving mechanical stress while the jacket is still in its molten or pliable state, the bonding surface becomes more stable and receptive, allowing tracers to bond more effectively without being compromised by subsequent shrink-back or stress-induced delamination
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal treatment effectively reduces residual mechanical stress in the patch cord jacket, improving the bonding process and significantly reducing shrink-back issues, enhancing the durability and reliability of the surface-bonded optical patch cords.
Implementation Method 1
A thermal treatment apparatus and method that includes a first passage way for the patch cord, a second passage way for the tracer, and at least one roller in a heated area to relieve stress
Implementation Method 2
at least one roller relieving stress of a jacket of the patch cord in a heated area by applying surface pressure to the patch cord
Implementation Method 3
a bonding point where the first passage way for the patch cord and the second passage way for the tracer intersect, wherein the tracer is surface bonded to the patch cord
Data Source
AI summary
A system, apparatus and method for thermal treatment of surface bonding optical is provided. An optical patch cord is surface bonded via thermal treatment with a tracer optical fiber which provides patch cord tracing in a bonding apparatus. During the process, the optical patch cord is also thermally treated to have the mechanical stress contained in its jacket relieved by rollers in the bonding apparatus to solve the patch cord shrink-back problem.