Optical Path Switching for Multi-Object Semiconductor Inspection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Defects on semiconductor substrates, such as foreign substances, can degrade the operation performance and productivity of semiconductor devices, and existing inspection methods are inefficient in detecting these defects across multiple stages of the manufacturing process.
Innovation Solution
An inspection apparatus with a light source and multiple measurement units, where a reflection mirror adjusts the optical path to direct light and optical signals to different measurement objects, allowing a single inspection unit to inspect multiple objects by alternately enabling their optical paths, thereby reducing inspection time and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple inspection units are used to inspect multiple measurement objects simultaneously, then inspection efficiency is improved, but device complexity and cost increase
Solution Approach 1:
The patent combines multiple measurement units (first measurement unit and second measurement unit) into a single inspection apparatus that shares common components including the light source, inspection unit, and control unit. This merging approach allows multiple measurement objects to be inspected simultaneously or alternately without requiring separate inspection systems, thereby improving inspection efficiency while avoiding the complexity and cost of multiple independent inspection units.
Solution Approach 2:
The inspection unit is designed with universal functionality to handle multiple measurement objects through different optical paths. The single inspection unit can receive optical signals from either the first measurement unit or the second measurement unit (or both simultaneously) and perform inspection on multiple measurement objects, making the system multi-functional without requiring separate specialized inspection units for each object.
2Device complexity
If a single inspection unit inspects multiple measurement objects sequentially, then device complexity is reduced, but inspection time increases
Solution Approach 1:
The patent employs a dynamic optical path switching mechanism using a reflection mirror that can be adjusted to direct optical signals from different measurement units to the inspection unit. The control unit dynamically controls the reflection mirror to switch between optical paths, enabling the single inspection unit to process multiple measurement objects in an optimized sequence or simultaneously, thereby reducing total inspection time while maintaining device simplicity.
Solution Approach 2:
The inspection system maintains continuous operation by eliminating idle time between inspections of different measurement objects. The control unit coordinates the optical path switching and inspection processes to ensure that the inspection unit continuously processes optical signals from multiple measurement units without interruption or unnecessary waiting periods, thereby minimizing inspection time while using a single inspection unit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus efficiently inspects material properties of multiple semiconductor substrates at various manufacturing stages, reducing defects and improving productivity by using a single inspection unit to analyze multiple objects with adjusted optical paths.
Implementation Method 1
A measurement position selection unit is configured to alternately enable the first and second optical paths by adjusting an angle of a reflection mirror
Data Source
AI summary
An inspection apparatus includes a light source. A first measurement unit is configured to receive light from the light source and direct it to a first measurement object. A second measurement unit is configured to receive the light from the light source and direct it to a second measurement object. An inspection unit is configured to receive a first optical signal provided from the first measurement unit and inspect the first measurement object using the first optical signal, and to receive a second optical signal provided from the second measurement unit and inspect the second measurement object using the second optical signal. A measurement position selection unit is configured to alternately enable the inspection of the two measurement units by adjusting an angle of a reflection mirror.