Optical PCB Fabrication with Embedded Fiber Connectors

The patent replaces electrical copper traces with optical fibers for high-speed data transmission. Optical fibers transmit data as light signals instead of electrical signals, eliminating electromagnetic interference and signal loss issues that plague copper traces at high data rates (>10 Gb/s). The optical fibers are embedded within the PCB structure, maintaining mechanical support while achieving superior signal quality at high speeds.

The patent creates a hybrid PCB structure combining both electrical conductors (copper traces) and optical fibers. This composite approach allows the PCB to leverage the strengths of both materials: copper for power delivery and low-speed control signals, and optical fibers for high-speed data transmission, achieving a balance between electrical functionality and optical performance.

The patent divides the PCB manufacturing process into separate stages: first manufacturing the PCB substrate with copper traces, then separately preparing optical fiber arrays with connectors, and finally assembling the optical components onto the PCB. This segmentation allows each component to be manufactured using optimized processes independently, reducing overall manufacturing complexity.

The patent performs preliminary preparation of optical fiber arrays before PCB assembly, including attaching connectors to the optical fibers in advance. This preliminary action allows connectors to be pre-positioned and secured, simplifying the final assembly process and enabling standardized integration procedures that reduce manufacturing complexity.

The patent designs optical fiber connectors with standardized engagement mechanisms that can interface with common external optical devices. The connectors incorporate universal features such as guide pins and alignment structures that enable compatibility across different device types, allowing a single PCB design to work with multiple external optical components without requiring custom interface designs.

The patent embeds optical fiber connectors within the PCB structure, nesting the connector components inside the PCB layers. The optical fibers are routed through the PCB substrate and terminated with connectors that are housed within recesses or cavities in the PCB, creating a compact integrated structure that reduces overall device footprint while maintaining connectivity functionality.