Optical PCB With Inclined Grooves For Low-Loss Waveguide Integration
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Solution Overview
Problem
Conventional optical printed circuit boards face issues with optical loss and complexity due to bent optical fibers, step differences during lamination, and limitations in design flexibility, particularly in high-precision applications.
Innovation Solution
The development of an optical printed circuit board with a receiving groove having an inclined angle, where an optical waveguide is formed and buried within, using a laser trench process or precision cutting, allowing for improved optical loss properties and design freedom by accurately arranging mirrors and waveguides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If optical fiber is bent at 90° to connect with signal transmitter and receiver, then optical connection is achieved, but optical loss is generated and transmission loss occurs due to high pressure during lamination
Solution Approach 1:
The optical fiber connection is divided into multiple segments: a first optical fiber extending from the first surface, a second optical fiber extending from the second surface, and separate receiving grooves for each. This segmentation eliminates the need for a single bent fiber, reducing optical loss while achieving optical connection between transmitter and receiver through multiple straight segments.
Solution Approach 2:
The patent transitions from a planar bent fiber configuration to a three-dimensional structure with fibers extending from opposite surfaces of the substrate. By utilizing the thickness dimension of the substrate, the optical path is reconfigured to avoid bending while maintaining connection, thereby reducing optical loss and transmission loss during lamination.
2Ease of operation
If optical fiber is bent at 90°, then optical connection is achieved, but total thickness of the optical module increases
Solution Approach 1:
The optical fiber connection is divided into multiple segments: a first optical fiber extending from the first surface, a second optical fiber extending from the second surface, and separate receiving grooves for each. This segmentation eliminates the need for a single bent fiber, reducing optical loss while achieving optical connection between transmitter and receiver through multiple straight segments.
Solution Approach 2:
The patent transitions from a planar bent fiber configuration to a three-dimensional structure with fibers extending from opposite surfaces of the substrate. By utilizing the thickness dimension of the substrate, the optical path is reconfigured to avoid bending while maintaining connection, thereby reducing optical loss and transmission loss during lamination.
3Device complexity
If layers are laminated to bury optical waveguide, then optical waveguide is protected and integrated, but step difference causes transmission loss due to high pressure
Solution Approach 1:
Receiving grooves are formed in the substrate before the optical fibers are positioned and before lamination occurs. This preliminary action creates pre-defined pathways that guide the optical fibers, ensuring proper alignment and preventing step differences during subsequent lamination processes, thereby avoiding transmission loss while achieving integration.
4Adaptability or versatility
If optical waveguide is formed by bending optical fiber, then optical path is created, but design flexibility is limited and mirrors cannot be accurately arranged
Solution Approach 1:
The optical fiber connection is divided into multiple segments: a first optical fiber extending from the first surface, a second optical fiber extending from the second surface, and separate receiving grooves for each. This segmentation eliminates the need for a single bent fiber, reducing optical loss while achieving optical connection between transmitter and receiver through multiple straight segments.
Solution Approach 2:
The patent transitions from a planar bent fiber configuration to a three-dimensional structure with fibers extending from opposite surfaces of the substrate. By utilizing the thickness dimension of the substrate, the optical path is reconfigured to avoid bending while maintaining connection, thereby reducing optical loss and transmission loss during lamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the laminating process, reduces optical loss, and improves the freedom of copper circuit designs, making the optical printed circuit board more suitable for high-precision applications.
Implementation Method 1
forming a receiving groove having an inclined angle on at least one end by processing the insulating substrate
Data Source
AI summary
Provided is an optical printed circuit board, including: a first insulating layer on which at least one receiving groove with an inclined angle on at least one end is formed; an optical waveguide which is formed in the receiving groove of the first insulating layer; and a second insulating layer which is formed on the first insulating layer and buries the optical waveguide formed in the receiving groove.