Optical PCB Waveguide Embedding for High-Speed Data Transmission
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Solution Overview
Problem
Conventional printed circuit boards (PCBs) using copper as electrical wirings face limitations in transmitting high-speed and large-capacity data due to their conductive nature, prompting the need for an alternative that can efficiently handle optical signals.
Innovation Solution
An optical PCB structure featuring an insulation layer with an embedded optical waveguide and optical devices mounted in cavities, where the optical waveguide is formed on a virtual straight line between the devices, minimizing transmission loss and simplifying manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If copper foil clad layer is used for electrical wirings, then electrical connections can be established, but high-speed and large-capacity data transmission is limited
Solution Approach 1:
The patent replaces the conventional copper-based electrical wiring system with an optical waveguide system that transmits light signals instead of electrical signals. This substitution enables high-speed and large-capacity data transmission by using optical carriers, which have higher bandwidth and faster transmission speeds compared to electrical signals in copper conductors.
2Ease of manufacture
If optical devices are mounted on the surface, then assembly is simple, but optical transmission loss increases
Solution Approach 1:
The patent embeds optical devices within cavities formed in the insulation layer, positioning them at specific depths rather than mounting them on the surface. The optical waveguide extends from these embedded devices, creating a nested structure where the waveguide is embedded within the insulation layer. This embedding approach minimizes optical transmission loss by ensuring proper alignment and reducing exposure to environmental factors while maintaining manufacturing feasibility.
3Speed
If complex structures are used to minimize transmission loss, then light transmission rate improves, but manufacturing complexity increases
Solution Approach 1:
The patent divides the insulation layer into multiple segments or layers, with cavities formed at specific depths within these segments. This segmentation allows for systematic embedding of optical devices and formation of optical waveguides at controlled positions, simplifying the manufacturing process while ensuring proper alignment and minimizing transmission loss. The segmented approach enables step-by-step fabrication rather than requiring complex monolithic structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances light transmission rates while reducing manufacturing complexity, resulting in an economical optical PCB with improved performance.
Implementation Method 1
An optical waveguide filled in the insulation layer
Data Source
AI summary
Provided is an optical Printed Circuit Board (PCB). The PCB includes: an insulation layer; an optical waveguide filled in the insulation layer; and an optical device buried in the insulation layer and disposed on the same plane as the optical waveguide.