Optical Position Detection for Plating Apparatus Substrate Holders

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Solution Overview

Problem

Existing plating apparatuses face challenges in maintaining uniform plating film thickness due to substrate holder position deviations caused by individual differences and external factors, requiring frequent adjustments and dedicated jigs for precise positioning.

Innovation Solution

A plating apparatus equipped with an optical sensor and detected parts on opposing members allows for real-time detection and adjustment of the substrate holder's position without a dedicated jig, ensuring accurate placement and preventing positioning abnormalities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a dedicated jig is used for position adjustment of the substrate holder, then positioning precision is improved, but device complexity and operation time increase

Engineering Contradiction:

Improvepositioning precisionVSAvoiddevice complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical dedicated jig system with an optical detection system. The optical sensor detects the position of detection marks on the substrate holder, and the control unit automatically calculates and adjusts the position, eliminating the need for mechanical jigs and manual positioning operations.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The substrate holder itself carries detection marks that enable it to be detected and positioned by the optical sensor system. The system uses the substrate holder's own features (detection marks) for positioning rather than requiring external dedicated jigs, allowing the substrate holder to participate in its own positioning process.

Inventive Principle:

Principle #25Self-service

2Manufacturing precision

If position adjustment is performed using a dedicated jig, then positioning precision is improved, but productivity decreases due to stopping the plating process

Engineering Contradiction:

Improvepositioning precisionVSAvoidproductivity

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent enables continuous position detection and adjustment during the plating process without stopping. The optical sensor continuously monitors the substrate holder position, and the control unit makes real-time adjustments, ensuring the plating process continues uninterrupted while maintaining positioning precision.

Inventive Principle:

Principle #20Continuity of useful action

Solution Approach 2:

The automated optical positioning system replaces manual jig-based adjustment, enabling non-contact, real-time position detection and correction that does not require interrupting the plating process, thereby maintaining continuous production flow.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Device complexity

If the substrate holder position is not monitored, then device complexity is reduced, but plating film uniformity deteriorates due to position deviations

Engineering Contradiction:

Improvedevice complexityVSAvoidplating film uniformity

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The patent implements a feedback control system where the optical sensor continuously detects the substrate holder position, the control unit compares the detected position with the target position, and automatically adjusts the substrate holder position to correct deviations, ensuring consistent plating film uniformity.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The optical feedback system replaces complex mechanical position monitoring mechanisms, providing simple yet effective real-time position detection and correction that maintains plating quality without significantly increasing device complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the uniformity of plating film thickness and maintains high yield by enabling early detection and correction of position abnormalities, allowing for continuous operation without stopping the plating process.

Implementation Method 1

an optical sensor disposed on one of the substrate holding member and the first member; and a plurality of detected parts disposed on the other of the substrate holding member and the first member to be detectable by the optical sensor

Methodology Applied

Scientific EffectLight reflection: Reflection

Data Source

PatentUS10597793B2Plating apparatus and recording medium recording program thereon

Publication Date: 2020.03.24 EBARA CORP

AI summary

The disclosure improves a position confirmation method for members in a plating tank. A plating apparatus for applying a plating process on a substrate is provided. The plating apparatus includes a plating tank, a first member disposed in the plating tank, a second member disposed opposite to the first member in the plating tank, an optical sensor disposed on one of the first and second members, and a plurality of detected parts disposed on the other of the first and second members to be detectable by the optical sensor.