Optical Pressure Sensing Module With Deformable Microstructures
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Solution Overview
Problem
Existing large-area optical multi-dimensional pressure sensing technologies are limited in research and development, lacking reliability and efficiency in various environmental conditions.
Innovation Solution
A sensing module comprising a photosensitive circuit board, a light source structure, a light manipulation sheet with optical microstructures, and a light shielding sheet, which deform under external forces to alter light patterns detected by photosensitive devices, enabling reliable large-area pressure sensing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If optical pressure sensing technology is used to achieve large-area sensing, then sensing area and reliability are improved, but research and development limitations and manufacturing complexity increase
Solution Approach 1:
The sensing module is divided into distinct functional layers including a light source layer, light manipulation layer with microstructures, and a photosensitive detection layer. This segmentation allows each layer to be optimized independently for large-area manufacturing while maintaining overall system reliability and reducing manufacturing complexity through modular assembly.
2Measurement precision
If optical microstructures are used to detect pressure, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The patent replaces complex mechanical pressure sensing mechanisms with an optical system. Pressure applied to the flexible substrate causes deformation of integrated optical microstructures, which modulates light transmission patterns detected by photosensitive devices. This optical substitution achieves high measurement precision while simplifying the overall device structure and reducing mechanical complexity.
Solution Approach 2:
The patent utilizes changes in optical parameters (light transmission intensity and pattern) in response to mechanical deformation of the flexible substrate. When pressure is applied, the substrate deforms, altering the optical path and light transmission characteristics detected by the photosensitive devices, thereby enabling precise pressure measurement through optical parameter changes rather than complex mechanical measurements.
3Adaptability or versatility
If multiple sensing dimensions are integrated, then adaptability is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent implements a universal sensing platform where a single flexible substrate integrates multiple sensing dimensions (pressure magnitude, pressure distribution, and potentially shear stress) through a unified optical detection mechanism. The light manipulation layer with its microstructures provides multi-functional capability, enabling the system to detect various mechanical stimuli simultaneously, thereby improving adaptability without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module achieves reliable and cost-effective large-area pressure sensing by detecting changes in light patterns to determine force magnitude and direction, enhancing sensing precision and reliability.
Implementation Method 1
the light manipulation sheet is adapted to receive an external force and press the light source structure through the light shielding sheet to deform the plurality of optical microstructures
Implementation Method 2
The photosensitive circuit board is provided with a plurality of photosensitive devices... detecting changes in light patterns to determine force magnitude and direction
Data Source
AI summary
A sensing module including a photosensitive circuit board, a light source structure, a light manipulation sheet and a light shielding sheet is provided. The photosensitive circuit board is provided with a plurality of photosensitive devices. The light source structure is disposed on one side of a photosensitive surface of each of the photosensitive devices. The light manipulation sheet is disposed between the photosensitive circuit board and the light source structure, and includes a substrate and a plurality of optical microstructures. The optical microstructures are disposed on a substrate surface of the substrate facing the light source structure. The light shielding sheet is disposed on one side of the light source structure facing away from the light manipulation sheet. The light shielding sheet is adapted to receive external force and press the light manipulation sheet through the light source structure to deform the plurality of optical microstructures.