Integrated Optical Probe Head for Precise Photonic Test Alignment
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Solution Overview
Problem
Existing probe heads face challenges in achieving precise and stable alignment of optical components within integrated photonic circuits, complicating the structure and requiring external mechanical systems for optical testing, while maintaining high performance and parallel testing of both electric and optical signals.
Innovation Solution
A probe head design incorporating vertical probes with integrated optical elements, utilizing a containment element with movable portions and piezoelectric transducers for precise alignment, allowing simultaneous electrical and optical testing without external mechanics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If external mechanical systems are used for optical alignment, then alignment precision can be achieved, but device complexity and structural bulk increase
Solution Approach 1:
The patent merges the optical alignment function directly into the probe head structure by integrating waveguides and optical elements within the containment element. This eliminates the need for separate external mechanical alignment systems, reducing overall device complexity while maintaining alignment precision through the integrated design.
Solution Approach 2:
The waveguides and optical elements are nested within the containment element that houses the contact probes. This nested arrangement allows the optical components to be positioned precisely within the existing probe head structure without requiring additional external mechanical systems, thereby reducing structural bulk while maintaining alignment capability.
2Adaptability or versatility
If integrated optical elements are added to probe head, then optical testing capability is enabled, but device complexity increases
Solution Approach 1:
The probe head is designed to perform both electrical testing through contact probes and optical testing through integrated waveguides simultaneously. This multi-functional design enables the same device to test both electrical and optical components of photonic devices without requiring separate testing apparatus, thereby enhancing versatility while managing complexity through integration.
Solution Approach 2:
The optical testing components (waveguides, optical elements) are merged with the electrical testing structure (contact probes, containment element) into a single integrated probe head. This combination allows simultaneous electrical and optical testing capabilities while distributing the complexity across a unified structure rather than separate systems.
3Reliability
If vertical probes with containment element are used, then electrical contact stability is improved, but optical alignment flexibility is reduced
Solution Approach 1:
The patent introduces movable portions within the containment element that can be adjusted to align optical components. This dynamic adjustment capability allows the rigid vertical probe structure to maintain electrical contact stability while the movable sections provide the necessary flexibility for optical alignment, resolving the contradiction between stability and flexibility.
Solution Approach 2:
The containment element is divided into fixed portions (for electrical contact stability) and movable portions (for optical alignment). This segmentation allows different parts of the same structure to serve different functions: the fixed portions maintain reliable electrical contact while the movable portions enable flexible optical alignment, thus resolving the contradiction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables simple and stable alignment of optical components with high accuracy, reducing complexity and cost, and facilitating parallel testing of integrated photonic devices.
Implementation Method 1
movement means adapted to move the second portion of the containment element with respect to the first portion
Data Source
AI summary
A probe head for a testing apparatus of electronic devices is disclosed having a plurality of contact probes, a guide provided with a plurality of guide holes for slidingly housing the contact probes, and a containment element which is adapted to support the guide. The containment element includes a first portion and a second portion which is movable with respect to the first portion, movement means adapted to move the second portion of the containment element with respect to the first portion, and a test optical signal distribution element configured to transmit a test optical signal to the device under test. The test optical signal distribution element is associated with the second portion of the containment element and is arranged to be moved integrally therewith. The movement means is configured to allow the alignment of the test optical signal distribution element.