Semiconductor Wafer Handling with Optical Probe for Hybrid Circuit Testing

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Solution Overview

Problem

Existing semiconductor wafer testing systems are unable to test devices under test (DUTs) that include both electrical and optical circuits, as they are designed to handle only electrical circuits.

Innovation Solution

A semiconductor wafer handling apparatus and system that incorporates an optical probe to input and output optical signals to and from an optical connection part on the semiconductor wafer, allowing for the testing of DUTs with both electrical and optical circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a conventional probe card system is used, then electrical circuits can be tested, but optical circuits cannot be tested

Engineering Contradiction:

Improvetesting capabilityVSAvoidsystem configuration

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines electrical probe cards and optical probes into a single integrated testing system. The probe card includes both electrical probes for contacting electrical terminals and optical probes for contacting optical connection parts, enabling simultaneous testing of both electrical and optical circuits on the same semiconductor wafer.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The probe card is designed to perform multiple functions: it can test both electrical circuits through electrical probes and optical circuits through optical probes. This multi-functional design allows a single testing system to handle diverse device types without requiring separate specialized equipment.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Measurement precision

If the optical probe is fixed, then alignment is simple, but testing accuracy decreases

Engineering Contradiction:

Improveoptical signal alignment accuracyVSAvoidoptical probe structure

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The optical probe is designed with movable components that allow dynamic adjustment of its position and orientation. This enables precise alignment with the optical connection part on the semiconductor wafer, ensuring accurate optical signal transmission while maintaining the ability to adapt to different testing requirements.

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS20250076366A1Semiconductor wafer handling apparatus and semiconductor wafer testing system

Publication Date: 2025.03.06 ADVANTEST CORP

AI summary

A semiconductor wafer handling apparatus that moves a semiconductor wafer including a device under test (DUT) and presses a terminal of the DUT against a contactor of a probe card, the semiconductor wafer handling apparatus includes an optical probe that inputs and outputs an optical signal to and from an optical connection part of the DUT. The terminal is disposed on a first surface of the semiconductor wafer. The optical connection part is disposed on a second surface of the semiconductor wafer.