Optical Projection Module Heat Dissipation Block Design
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Solution Overview
Problem
Optical projection modules face challenges in dissipating heat generated by light sources, leading to potential distortion of components and degradation in projective quality.
Innovation Solution
The optical projection module incorporates a heat dissipation block with specifically designed escaping holes and heat dissipation blocks made of metal or other efficient materials, which are fixed within these holes to direct heat away from the module, reducing temperature and preventing distortion of light beams.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a light source is mounted on the printed circuit board to enable optical projection, then the projection function is achieved, but heat is generated that is difficult to dissipate causing component distortion
Solution Approach 1:
The patent extracts the heat dissipation function from the standard PCB structure by introducing a dedicated heat dissipation block with thermal conductive material. This separate heat dissipation component is coupled to the light source mounting area, allowing heat to be extracted from the optical path region and transferred to the heat dissipation block, which then conducts heat to the PCB or dissipates it through dedicated pathways, preventing heat-induced distortion of optical components
Solution Approach 2:
The patent introduces a thermal conductive material as an intermediary between the light source mounting area and the heat dissipation block. This intermediary substance facilitates efficient heat transfer from the light source region through the semiconductor substrate to the heat dissipation block, enabling effective thermal management while maintaining the optical projection function
2Temperature
If heat dissipation blocks are added to manage thermal energy, then temperature control is improved, but the device structure becomes more complex
Solution Approach 1:
The patent merges the heat dissipation block with the PCB structure by coupling the heat dissipation block to the PCB, allowing the PCB to serve dual functions as both the electrical circuit board and the heat dissipation pathway. The thermal conductive material bridges the light source mounting area to the heat dissipation block, creating an integrated thermal management system that leverages existing structural components rather than adding entirely separate systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages heat dissipation, minimizing temperature-related distortions and enhancing the projective quality of the optical projection module by ensuring that heat is efficiently directed outside, thereby maintaining the integrity of light beams.
Implementation Method 1
A light source 30 and an optical member 40 are mounted on a fourth surface 2002 of the semiconductor substrate 20... A heat dissipation block 46 is received in each escaping hole 45... to direct heat away from the module, reducing temperature
Implementation Method 2
The heat dissipation block 46 can be made of metal or other materials having good heat dissipation efficiency... effectively manages heat dissipation, minimizing temperature-related distortions
Data Source
AI summary
An optical projection module with improved heat dissipation includes a circuit board having a first surface and a second surface opposite the first surface. A semiconductor substrate is mounted on the first surface. The semiconductor substrate has a third surface facing the first surface and a fourth surface opposite to the third surface. A light source and an optical member are mounted on the fourth surface. The optical member includes a lens holder. The lens holder defines a receiving space for receiving the light source. The lens holder further defines at least one escaping hole. A heat dissipation block is received in each escaping hole.