Optical Proximity Sensor Molded Isolation Eliminates Metal Shield
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Solution Overview
Problem
Existing optical proximity sensors face challenges with high manufacturing costs, complexity, and reliability issues due to the need for metal shields, which are difficult to produce in high volumes and attach efficiently, especially as devices become smaller, leading to increased bulk and interference.
Innovation Solution
The design eliminates the need for a metal shield by using an optically transmissive material to separate the infrared light emitter and detector, with a molded infrared light pass component and an infrared light cut component to minimize crosstalk, allowing for a smaller, more reliable, and cost-effective optical proximity sensor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal shield is used to provide optical isolation between light emitter and detector, then optical interference is minimized, but manufacturing complexity and cost increase
Solution Approach 1:
The patent removes the metal shield component entirely from the optical proximity sensor design. Instead of using a metal shield to block optical interference, the invention uses an optically transmissive material that allows light to pass through while maintaining isolation between the emitter and detector through its physical structure and optical properties.
Solution Approach 2:
The patent introduces an optically transmissive material as an intermediary substance between the light emitter and detector. This material serves as a mediator that provides optical isolation without requiring a metal shield, allowing light to transmit while maintaining the necessary separation and preventing direct optical interference between the emitter and detector.
2Object-affected harmful factors
If a metal shield is used to separate light emitter and detector, then optical isolation is improved, but manufacturing cost increases
Solution Approach 1:
The patent replaces the expensive metal shield with a more economical optically transmissive material. This material can be manufactured at lower cost and in higher volumes, reducing the overall manufacturing cost of the optical proximity sensor while maintaining adequate optical isolation performance.
Solution Approach 2:
The patent changes the optical parameters of the isolation material from metallic (reflective, opaque) to transmissive (transparent, light-passing). This parameter change allows the material to provide optical isolation through transmission rather than reflection, enabling cost-effective manufacturing while maintaining the necessary optical separation between emitter and detector.
3Volume of moving object
If device size is reduced to meet miniaturization requirements, then portability is improved, but manufacturing precision requirements increase
Solution Approach 1:
By removing the metal shield component, the patent reduces the overall number of parts and assembly steps, which relaxes the dimensional tolerance requirements. The optically transmissive material can be molded as a single integrated component, eliminating the need for precise metal shield fabrication and assembly, thereby enabling miniaturization without proportionally increasing manufacturing precision requirements.
Solution Approach 2:
The patent merges the optical isolation function with the housing or substrate structure by using an optically transmissive material that can be molded as an integrated component. This consolidation eliminates the need for separate metal shield parts, reducing assembly complexity and allowing for smaller overall device dimensions while maintaining adequate optical isolation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, eliminates the need for complex metal shields, and enhances the sensor's performance by minimizing optical interference, resulting in a smaller, more reliable, and cost-effective optical proximity sensor.
Implementation Method 1
molding an infrared light pass component over the infrared light emitter, the infrared light detector, the ambient light detector, the integrated circuit, and portions of the substrate
Implementation Method 2
molding an infrared light cut component over the slot and the integrated circuit, and over portions of the infrared light emitter, the ambient light detector, and the infrared light detector such that first, second and third apertures are formed over the infrared light emitter, the ambient light detector, and the infrared light detector, respectively
Data Source
AI summary
Various embodiments of a multiple-stage-molded optical proximity sensor and method of making same are disclosed. According to one embodiment, the method comprises mounting an infrared light emitter atop a first portion of a substrate, and mounting an infrared light detector, an ambient light detector and an integrated circuit atop a second portion of the substrate. In a first molding step, an infrared light pass component is molded over the substrate and the infrared light emitter, the infrared light detector, the ambient light detector, and the integrated circuit. The infrared light pass component is then cured, followed by forming a slot in the cured infrared light pass component between the first and second portions of the substrate. In a second molding step, an infrared light cut component is molded over the slot, the integrated circuit, the ambient light detector, and over portions of the infrared light emitter and the infrared light detector.