Optical Redistribution Layer Integration in IC Packages
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Solution Overview
Problem
Current IC chip packaging technologies face challenges in efficiently integrating optical and electrical components, leading to increased complexity, cost, and reduced flexibility in manufacturing.
Innovation Solution
The development of optical Redistribution Layer (oRDL) features, which are optically transmissive interconnects formed using optically transmissive materials, allowing for the integration of optical components within the package while also incorporating electrical Redistribution Layer (eRDL) features, enabling both optical and electrical coupling to external interfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional separate fabrication processes are used for electrical and optical interconnects, then functional requirements are met, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines the fabrication of electrical redistribution layers (eRDL) and optical redistribution layers (oRDL) into a single integrated process. The oRDL is formed within the same build-up layers as the eRDL, using shared materials and processing steps. This merging eliminates the need for separate fabrication sequences, reducing manufacturing complexity and cost while maintaining the distinct electrical and optical functions.
2Adaptability or versatility
If optical and electrical components are integrated in the same package, then functionality is enhanced, but interference between components may occur
Solution Approach 1:
The patent applies local quality by assigning different material properties to different regions of the interconnect structure. The oRDL uses optically transmissive materials in specific areas to allow optical signal passage, while eRDL regions use electrically conductive materials for electrical signals. The build-up layers are selectively configured to provide electrical isolation for eRDL while maintaining optical transparency for oRDL, thus preventing interference between the two component types through localized material property optimization.
Data Source
AI summary
Disclosed is a package comprising a substrate having a patterned surface with an optical contact area, an optical redistribution layer (oRDL) feature, and a build-up material extending over the patterned surface of the substrate and around portions of the oRDL features. In some embodiments, the package comprises a liner sheathing the oRDL features. In some embodiments, the oRDL feature extends through openings in an outer surface of the build-up material and forms posts extending outward from the outer surface. In some embodiments, the package comprises an electrical redistribution layer (eRDL) feature, at least some portion of which overlap at least some portion of the oRDL feature. In some embodiments, the package comprises an optical fiber coupled to the oRDL features.