Optical Device Relay Substrate Air Gap Radiation Loss

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Solution Overview

Problem

Current optical modulators face challenges in minimizing signal propagation loss due to radiation loss in relay substrates with conductor-backed coplanar waveguide structures, which increases manufacturing costs and limits material choices, and this issue affects both electro-optic and electro-absorption modulators.

Innovation Solution

The optical device incorporates a relay substrate with a dielectric substrate and support parts that form an air gap between the substrate and the housing, reducing radiation loss by concentrating the electric field on the coplanar line without the need for grooving, thus simplifying the configuration and expanding material choices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If grooving is performed on the dielectric substrate to suppress radiation loss, then signal propagation loss is reduced, but manufacturing cost increases and material choices are limited

Engineering Contradiction:
Improvesignal propagation lossVSAvoidmanufacturing cost and material flexibility
Core Design Contradiction:
Loss of energyVSEase of manufacture

Solution Approach 1:

The invention extracts the air gap from the substrate structure by introducing support parts that elevate the relay substrate above the housing bottom surface. This removes the need for grooving the dielectric substrate while achieving the same radiation loss suppression effect, as the air gap is created externally rather than by modifying the substrate itself.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The support parts act as intermediary elements between the relay substrate and the housing bottom surface. These support parts create and maintain the air gap without requiring modifications to the dielectric substrate, thus mediating the relationship between the substrate and housing to achieve radiation loss suppression while preserving manufacturing simplicity and material flexibility.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Loss of energy

If grooving is performed on the dielectric substrate to suppress radiation loss, then signal propagation loss is reduced, but device complexity increases

Engineering Contradiction:
Improvesignal propagation lossVSAvoidsubstrate structure complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The invention extracts the air gap creation process from the substrate structure by using separate support parts. This separates the radiation loss suppression function from the substrate itself, maintaining substrate structural simplicity while achieving the desired electromagnetic performance through the externally created air gap.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention segments the air gap creation function from the substrate by introducing separate support parts. The support parts are discrete elements that can be independently designed and positioned, allowing the air gap to be created without modifying the substrate structure, thus reducing overall device complexity while achieving radiation loss suppression.

Inventive Principle:
Principle #1Segmentation

3Ease of operation

If a CBCPW structure is used in the relay substrate, then connection ease is improved, but radiation loss to the dielectric substrate increases

Engineering Contradiction:
Improveconnection easeVSAvoidradiation loss
Core Design Contradiction:
Ease of operationVSLoss of energy

Solution Approach 1:

The invention converts the harmful radiation loss to the dielectric substrate into a beneficial configuration by creating an air gap. The support parts elevate the relay substrate to form this air gap, which transforms the problematic close coupling between the CBCPW structure and substrate into a beneficial decoupled configuration that reduces radiation loss while preserving the ease of connection provided by the CBCPW structure.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively suppresses signal propagation loss and enhances optical modulation performance, particularly at higher frequencies, while maintaining mechanical strength and reducing manufacturing complexity.

Implementation Method 1

reducing radiation loss by concentrating the electric field on the coplanar line

Methodology Applied
Scientific EffectElectric field concentration: Electric Field

Implementation Method 2

an optical modulator having an electro-optical element having an optical waveguide and a modulation electrode

Methodology Applied
Scientific EffectElectro-optic effect: Electro-Optic Effects

Data Source

PatentUS20180284488A1Optical device
Publication Date: 2018.10.04 SUMITOMO OSAKA CEMENT CO LTD
  • US20180284488A1 patent drawing
  • US20180284488A1 patent drawing
  • US20180284488A1 patent drawing

AI summary

An optical device includes: an electro-optical element; a connector for input and output of an electric signal; a relay substrate electrically connecting the connector and the optical element; a pair of support parts supporting the relay substrate; and a housing accommodating the optical element, the relay substrate, and the pair of support parts, in which the optical element includes a substrate having an optical waveguide formed therein, and a modulation electrode formed on a surface of the substrate, the relay substrate includes a dielectric substrate, and a signal electrode and a ground electrode provided on one principal surface of the dielectric substrate, the signal electrode and the ground electrode are electrically connected to the modulation electrode and the connector, the support parts clamps the relay substrate, and an air gap is formed between the other principal surface of the relay substrate and an inner bottom surface of the housing.