Optical ROIC Integration for High-Resolution SWIR Imaging
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Solution Overview
Problem
Current SWIR image sensor technologies are expensive, limited to small area applications, require complex processes, and result in low pixel resolution, making them unsuitable for flexible, high-resolution, and cost-effective use in consumer products.
Innovation Solution
An image capture device comprising a non-pixelated non-visible sensitive light source, an optical transfer medium, and a visible image sensor, which eliminates the need for epitaxial growth and chip bonding processes, utilizing a flexible material and a visible image sensor with high pixel resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional SWIR image sensor technologies are used, then high absorption efficiency and carrier drift velocity are achieved, but the cost becomes extremely expensive and pixel resolution is limited to below 1 million pixels
Solution Approach 1:
The patent uses a visible light image sensor as a copy/analogue to detect SWIR images. Instead of directly detecting SWIR light with expensive III-V materials, the system converts SWIR images to visible light images using an optical transfer medium, then uses a standard CMOS sensor to capture the converted visible light, achieving high resolution at lower cost
Solution Approach 2:
The patent introduces an optical transfer medium as an intermediary between the SWIR light source and the visible light sensor. This medium converts SWIR wavelengths to visible wavelengths, enabling the use of inexpensive CMOS sensors for SWIR imaging applications
2Reliability
If epitaxial growth process is used for SWIR photodetector pixel arrays, then high absorption efficiency is achieved, but the process becomes complicated and expensive, limiting pixel resolution
Solution Approach 1:
The patent replaces the complex epitaxial growth process with a simpler optical conversion approach. Instead of fabricating pixelated SWIR photodetectors through expensive epitaxial processes, the system uses a standard visible light sensor and optical transfer medium to achieve SWIR detection functionality
Solution Approach 2:
The patent substitutes the mechanical/chemical epitaxial growth process with an optical conversion mechanism. Rather than growing crystalline SWIR-sensitive materials through complex semiconductor fabrication, the system uses optical wavelength conversion to achieve the same detection function
3Adaptability or versatility
If chip bonding processes are used to connect SWIR photodetector pixel arrays to ROIC, then functional integration is achieved, but the process becomes problematic and costly
Solution Approach 1:
The patent uses a standard visible light image sensor with existing ROIC technology as a copy of the desired SWIR sensor. This approach leverages成熟的CMOS sensor fabrication and packaging processes, avoiding the need for specialized chip bonding processes required by III-V material sensors
Solution Approach 2:
The patent makes the visible light image sensor serve multiple functions: it detects visible light normally, and through the optical transfer medium, detects SWIR light. This universal sensor approach eliminates the need for separate SWIR photodetector fabrication and chip bonding processes
4Measurement precision
If pixelation is applied to SWIR photodetector arrays, then image resolution is improved, but the photolithography process becomes more complicated and expensive
Solution Approach 1:
The patent uses the existing pixelation of standard CMOS image sensors as a copy of the desired SWIR pixel array. Since CMOS sensors already use well-established photolithography processes for pixelation, the system inherits high resolution without requiring additional complex photolithography steps for SWIR detection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a flexible, low-cost, high-resolution image capture device capable of operating at room temperature, with pixel resolutions exceeding several hundred million pixels, suitable for various applications including night vision and LiDAR systems.
Implementation Method 1
an optical transfer medium, and a non-pixelated non-visible sensitive light source that converts non-visible medium into visible light
Data Source
AI summary
An image capture device is described. The image capture device includes a visible image sensor, an optical transfer medium, a non-pixelated non-visible sensitive light source, and a non-visible sensitizing part. The visible image sensor is configured to receive visible light indicative of a scene and generate an image depicting the scene. The optical transfer medium is on the visible image sensor. The optical transfer medium is constructed of a material operable to pass visible light indicative of the scene to the visible image sensor. The non-pixelated non-visible sensitive light source is connected to the optical transfer medium. The light source is configured to generate visible light indicative of the scene in response to non-visible medium stimulation. The non-visible sensitizing part is configured to detect the non-visible medium indicative of the scene.