Optical Semiconductor Sealing Composition Transparency Adhesion
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Solution Overview
Problem
Conventional optical semiconductor sealing materials used in LED applications become turbid upon curing, leading to reduced transparency and light taking-out efficiency in optical semiconductor apparatus.
Innovation Solution
A curable composition comprising a linear polyfluoro compound, cyclic organopolysiloxane with hydrogen and perfluoroalkyl groups, a platinum group metal catalyst, and specific cyclic organopolysiloxanes with epoxy and carboxylic acid anhydride residues, which provides excellent adhesion and transparency when cured, maintaining high light transmittance and refractive index.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional sealing compositions are used to provide adhesion and curing properties, then adhesion to base materials is improved, but transparency and light taking-out efficiency are degraded
Solution Approach 1:
The patent changes the chemical composition parameters by using a fluoropolyether compound with specific molecular structure (formula 1) containing perfluoropolyether groups, and carefully controls the molar ratios of components (A) and (B) to achieve both adhesion and transparency. The platinum catalyst system and curing conditions are optimized to maintain optical clarity while achieving proper adhesion.
Solution Approach 2:
The patent creates a composite sealing material system combining fluoropolyether compound (A), cyclic organopolysiloxane (B), and platinum catalyst (C) in specific proportions. This composite approach allows the material to simultaneously achieve adhesion to base materials through the organopolysiloxane component while maintaining transparency through the fluoropolyether base compound.
2Strength
If conventional sealing compositions are used to achieve curing and mechanical properties, then mechanical strength is improved, but light taking-out efficiency is reduced
Solution Approach 1:
The patent optimizes the molecular weight and structural parameters of the fluoropolyether compound (formula 1) to balance mechanical strength and optical transparency. The perfluoropolyether groups provide mechanical integrity while the specific molecular architecture maintains light transmission, reducing energy loss in LED applications.
Solution Approach 2:
The patent introduces perfluoropolyether groups at specific locations within the molecular structure (formula 1) to provide localized mechanical strength, while the overall polymer matrix maintains optical clarity. This localized functional grouping allows simultaneous achievement of mechanical properties and light transmission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a cured material with excellent transparency and adhesion, ensuring high light taking-out efficiency and mechanical properties, suitable for protecting LEDs and other optical semiconductor devices.
Implementation Method 1
0.1 to 500 ppm of a platinum group metal catalyst when converted into a platinum group metal atom
Implementation Method 2
a linear polyfluoro compound which has at least two alkenyl groups per molecule... cyclic organopolysiloxane which has a hydrogen atom directly bonded to a silicon atom
Data Source
AI summary
There are provided an optical semiconductor sealing curable composition that provides a cured material having excellent transparency, and an optical semiconductor apparatus having an optical semiconductor device sealed using the cured material obtained by curing the optical semiconductor sealing curable composition. There is provided an optical semiconductor sealing curable composition containing: (A) a linear polyfluoro compound; (B) cyclic organosiloxane having an SiH group and a fluorine-containing organic group; (C) a platinum group metal catalyst; (D) cyclic organosiloxane having an SiH group, fluorine-containing organic group, and an epoxy group; and (E) cyclic organosiloxane having an SiH group, a fluorine-containing organic group, and a cyclic carboxylic acid anhydride residue.