Optical Semiconductor Sealing Ring Integration for Reliable Packaging
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Solution Overview
Problem
The complexity of sealing structures for optical semiconductor devices increases manufacturing costs due to the number of components required for effective protection from the external environment.
Innovation Solution
An optical semiconductor apparatus with a translucent support substrate, a buffer layer, a seal ring in a frame shape on the outer region, and an active layer sealed by the seal ring and a sealing part, reducing the need for a package substrate or lid body for complete sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a complex sealing structure with multiple components (package substrate, lid body, metal seal ring, brazing filler metal) is used to protect the optical semiconductor device, then the sealing reliability is improved, but the number of components and manufacturing cost increase
Solution Approach 1:
The patent merges the sealing function and the electrode function into a single integrated structure. The seal ring is formed by a conductive material that simultaneously provides electrical connection (electrode) and sealing (metal seal ring), eliminating the need for separate electrode and seal ring components. This integration directly reduces the number of components while maintaining sealing reliability through the brazing filler metal connection between the integrated seal ring and the lid body.
2Reliability
If a complex sealing structure with multiple components is used to protect the optical semiconductor device, then the sealing reliability is improved, but the manufacturing cost increases
Solution Approach 1:
The patent merges the sealing function and the electrode function into a single integrated structure. The seal ring is formed by a conductive material that simultaneously provides electrical connection (electrode) and sealing (metal seal ring), eliminating the need for separate electrode and seal ring components. This integration directly reduces the number of components while maintaining sealing reliability through the brazing filler metal connection between the integrated seal ring and the lid body.
3Ease of manufacture
If a simplified sealing structure with fewer components is used, then the manufacturing cost is reduced, but the sealing reliability may be compromised
Solution Approach 1:
The patent merges the sealing function and the electrode function into a single integrated structure. The seal ring is formed by a conductive material that simultaneously provides electrical connection (electrode) and sealing (metal seal ring), eliminating the need for separate electrode and seal ring components. This integration directly reduces the number of components while maintaining sealing reliability through the brazing filler metal connection between the integrated seal ring and the lid body.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the number of components and manufacturing costs while maintaining reliable sealing, using a gold-tin alloy for low-temperature sealing and AuSn eutectic bonding to enhance sealing performance and durability.
Implementation Method 1
a sealing part that seals a space between the seal ring and the package substrate... using a gold-tin alloy for low-temperature sealing and AuSn eutectic bonding to enhance sealing performance and durability
Data Source
Figure 1~2
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Figure 6~7
AI summary
An optical semiconductor apparatus 10 includes: an optical semiconductor device 12 including a translucent support substrate 20; a buffer layer 22 on the support substrate 20, a seal ring (e.g., a first electrode 32) in a frame shape provided in an outer region 60 on the buffer layer 22, an active layer 26 provided on an inner region 62 of the buffer layer 22, and an electrode (e.g., a second electrode 34) provided on the active layer 26. The optical semiconductor apparatus 10 further including: a package substrate 14 on which the optical semiconductor device 12 is mounted; and a sealing part 16 that seals a space between the seal ring and the package substrate 14.