High-throughput optical sectioning 3D imaging system
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Solution Overview
Problem
Current optical sectioning technologies, such as confocal and multi-photon excitation microscopy, have insufficient imaging throughput for large-size samples, and structured illumination microscopy, while faster, requires complex systems and mosaic stitching, limiting imaging speed and quality, especially for three-dimensional imaging.
Innovation Solution
A high-throughput optical sectioning three-dimensional imaging system that modulates light beams to focus on focal planes and defocus on defocusing planes, imaging sample strips in different rows, and reconstructs images using a demodulation module to achieve efficient three-dimensional imaging by dividing samples into layers and strips, improving speed and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If confocal or multi-photon excitation microscopic imaging technology is used to achieve optical sectioning, then imaging quality is improved, but imaging throughput is insufficient for large-size samples
Solution Approach 1:
The patent segments the wide-field illumination into multiple line beams that scan across the sample in a raster pattern. This segmentation allows the system to maintain wide-field illumination advantages while achieving optical sectioning through sequential line-by-line scanning, thereby improving imaging throughput for large-size samples without sacrificing imaging quality
Solution Approach 2:
The patent employs periodic scanning of line beams across the sample in a raster pattern, repeatedly illuminating and scanning the same regions. This periodic action enables comprehensive coverage of large samples while maintaining optical sectioning capability, improving overall imaging throughput through systematic repeated scanning
2Productivity
If structured illumination microscopic imaging technology is used to improve imaging throughput, then imaging speed is improved, but system complexity increases due to mosaic stitching requirements
Solution Approach 1:
The patent uses dynamically scanned line beams that can adjust their scanning pattern and coverage area. This dynamic scanning approach allows the system to adapt to different sample sizes and imaging requirements without requiring complex mosaic stitching, thereby maintaining high imaging speed while reducing system complexity
Solution Approach 2:
The patent creates a universal imaging system that can handle both small and large samples using the same line beam scanning mechanism. The system eliminates the need for different imaging modes or complex stitching algorithms by providing a unified approach that works across various sample sizes, reducing overall system complexity
3Measurement precision
If conventional structured illumination microscopic imaging method is used to achieve optical sectioning, then imaging quality depends on modulation pattern contrast, but imaging speed is limited due to multiple scanning passes
Solution Approach 1:
The patent implements continuous line beam scanning across the sample without requiring multiple separate scanning passes. The raster scanning pattern ensures continuous illumination and detection, eliminating idle time between scans and maintaining high imaging speed while achieving optical sectioning through the continuous scanning action
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system enhances imaging speed and efficiency by cutting off imaged surface layers and reconstructing three-dimensional images from sample strips, overcoming the limitations of existing technologies in throughput and complexity, particularly for large-size samples.
Implementation Method 1
a light beam modulation module configured to modulate a light beam into a modulated light beam capable of being focused on a focal plane of an objective lens and being defocused on a defocusing plane of the objective lens
Implementation Method 2
an imaging module configured to image, in different rows of pixels, at least one sample strip of at least one surface layer of a sample under illumination of the modulated light beam
Implementation Method 3
a demodulation module configured to demodulate a sample image of one sample strip of one surface layer into an optical sectioning image, and reconstruct the optical sectioning image of each sample strip of each surface layer into a three-dimensional image
Data Source
AI summary
A high-throughput optical sectioning three-dimensional imaging system which includes: a light beam modulation module configured to modulate a light beam into a modulated light beam capable of being focused on a focal plane of an objective lens and being defocused on a defocusing plane of the objective lens; an imaging module configured to employ a camera to image, in different rows of pixels, a sample under illumination of the modulated light beam; a cutting module configured to cut off an imaged surface layer of the sample; a demodulation module configured to demodulate a sample image of one sample strip of one surface layer into an optical sectioning image, and reconstruct the optical sectioning image of each sample strip of each surface layer into a three-dimensional image. The present disclosure achieves imaging of a whole sample by dividing the sample into at least one surface layer, dividing the at least one surface layer into at least one sample strip, and imaging each sample strip. When a multi-layer imaging cannot be performed, the imaged part can be cut off by the cutting module to realize imaging of any layer of the sample, thereby improving the imaging speed and efficiency.