Optical Security Element Transfer Using a Speed-Matching Carrier
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Solution Overview
Problem
Existing transfer methods for optical security elements are limited by the need for precise alignment of transfer elements on the target substrate, leading to reduced processing speed and increased costs due to the use of movable stamps or complex substrate arrangements.
Innovation Solution
A transfer device that allows flexible spacing of transfer elements on the target substrate by temporarily transferring them onto a transport carrier, using a detachment unit to change the direction of the transfer substrate and applying adhesive on the side facing away from the transfer substrate, enabling higher speed processing while maintaining positioning accuracy and connection stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If transfer elements are arranged at a greater distance on the target substrate than on the transfer substrate, then spacing flexibility is improved, but processing speed decreases due to the need for precise alignment
Solution Approach 1:
The patent introduces a transport carrier as an intermediary component between the transfer substrate and the target substrate. The transfer elements are first detached from the transfer substrate and temporarily transferred to the transport carrier, which then transports them to the target substrate. This intermediary allows the transport carrier to be accelerated to match the speed of the target substrate, enabling high-speed processing while maintaining the ability to accommodate greater spacing between transfer elements on the target substrate.
2Productivity
If the speed of the target substrate is increased to maintain high processing speed, then productivity is improved, but positioning accuracy deteriorates due to the speed difference with the transfer substrate
Solution Approach 1:
The transport carrier acts as a speed-matching intermediary. It is accelerated to the speed of the target substrate and maintains this speed during the transfer process. This allows the transfer elements to be positioned accurately on the high-speed moving target substrate, as the relative speed difference during the actual transfer is minimized when the transfer element is already on the transport carrier moving at the same speed as the target substrate.
Solution Approach 2:
The transport carrier is pre-accelerated to match the speed of the target substrate before the transfer elements are transferred onto it. This preliminary speed matching ensures that when the transfer elements are later transferred from the transport carrier to the target substrate, the positioning accuracy is maintained despite the high operating speeds involved in the process.
3Adaptability or versatility
If a movable stamp is used instead of rollers to achieve distance flexibility, then spacing adaptability is improved, but processing speed decreases
Solution Approach 1:
Instead of using a movable stamp, the patent employs a transport carrier as a mediator that can be accelerated to high speeds. The transport carrier maintains synchronization with the target substrate through acceleration, enabling the system to achieve both spacing flexibility and high processing speeds without requiring mechanical stamps or complex substrate arrangements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables higher processing speeds and reduced material costs by allowing greater speed differences and maintaining connection stability, while accommodating varying distances between transfer elements on the target substrate.
Implementation Method 1
An adhesive, which creates the permanent bond, is arranged on the side of the transfer element facing away from the transfer substrate. The adhesive, which creates the permanent bond, is heated.
Data Source
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AI summary
The invention relates to a method in a transfer device, comprising - providing a plurality of transfer elements (9) on a transfer substrate (5), the transfer elements (9) being arranged one behind the other with a first spacing (d1) on the transfer substrate (5); - detaching a transfer element (9) from the transfer substrate (5); - moving a target substrate (6) at a speed (v2); - permanently joining the transfer element (9) to the moving target substrate (6); transfer elements (9) being arranged on the target substrate (6) with a second spacing (d2) which is greater than the first spacing (d1); characterized by - temporarily moving the transfer element (1) detached from the transfer substrate (5) onto a transport carrier (20) of the transfer device (10, 20, 30), and - transporting the transfer element (9) on the transport carrier (20) at the speed of the target substrate (6) even before contact with the target substrate (6).