Optical Semiconductor Active Region Array Thermal Uniformity

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Solution Overview

Problem

In high-density integration of semiconductor lasers for optical interconnection, temperature variations due to heat generation lead to non-uniform oscillation characteristics and wavelengths, affecting the performance of each laser.

Innovation Solution

The optical semiconductor device features an array of active regions disposed more densely at the ends than at the center, with a semiconductor substrate and burying layers to promote uniform heat diffusion and thermal conductivity, ensuring consistent temperature across the active regions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If semiconductor lasers are integrated at high density, then the transmission capacity and speed of optical interconnection are improved, but temperature variations occur due to heat generation, causing non-uniform oscillation characteristics and wavelength shifts

Engineering Contradiction:
Improvetransmission capacityVSAvoidtemperature uniformity
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The patent applies local quality by varying the spacing between active regions based on their position in the array. Regions at the ends have smaller spacing compared to the center, creating non-uniform local characteristics that compensate for heat distribution patterns. This local adjustment ensures uniform temperature and oscillation characteristics across all active regions despite high-density integration

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the geometric parameter of active region spacing to optimize thermal performance. By adjusting the spacing parameter differently at various positions (smaller at ends, larger at center), the patent achieves uniform temperature distribution and stable oscillation characteristics while maintaining high integration density

Inventive Principle:
Principle #35Parameter changes

2Area of stationary object

If the spacing between active regions is reduced for high-density integration, then the device size is reduced, but temperature variations increase due to heat accumulation, affecting oscillation stability

Engineering Contradiction:
Improvedevice sizeVSAvoidoscillation stability
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The patent implements local quality by applying different spacing strategies to different regions of the active region array. End regions have smaller spacing to maximize density, while center regions have larger spacing to facilitate heat dissipation. This localized differentiation maintains both compact size and oscillation stability

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent introduces asymmetry in the spacing pattern of active regions. Rather than uniform spacing, the asymmetric arrangement with varying intervals creates optimal thermal pathways while maintaining high integration density, thereby ensuring reliable oscillation characteristics across the array

Inventive Principle:
Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration maintains uniform temperatures among active regions, stabilizing oscillation characteristics and wavelengths, enhancing the performance and reliability of the optical semiconductor device for optical interconnection.

Implementation Method 1

an array having a plurality of active regions arranged on the substrate so as to emit light toward the same direction, the plurality of active regions being disposed in ends of the array more densely than in the center of the array in a direction crossing the light emitting direction

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS9130352B2Optical semiconductor device, light emitting device, optical transmitting device, and method of manufacturing optical semiconductor device
Publication Date: 2015.09.08 NEC CORP
  • US9130352B2 patent drawing
  • US9130352B2 patent drawing
  • US9130352B2 patent drawing

AI summary

An optical semiconductor device includes: a substrate of semiconductor; an array having a plurality of active regions arranged on the substrate so as to emit light to the same direction, the plurality of active regions being arranged more densely at ends of the array than in the center of the array in a direction crossing the light emitting direction; and electrodes which inject current to the plurality of active regions.