Optical Semiconductor Device with Beam Splitter for Compact Packaging
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Solution Overview
Problem
Existing optical semiconductor devices with wavelength lockers and tunable lasers face challenges in downsizing due to the combination of optical components, which results in increased device length and difficulty in reducing packaging area.
Innovation Solution
The optical semiconductor device incorporates a beam splitter that splits the input optical axis into two axes with different split angles, allowing for a more compact design by inclining the optical semiconductor element and its output axes to optimize the placement of optical components, thereby reducing the device's overall size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a wavelength locker including an etalon is combined with a semiconductor laser on the output optical axis, then output wavelength stabilization with high accuracy is achieved, but the device length increases and downsizing becomes difficult
Solution Approach 1:
The patent changes the arrangement from a one-dimensional linear configuration along the output optical axis to a two-dimensional planar configuration using a beam splitter. The wavelength locker components (etalon, light receiving elements) are arranged in different spatial dimensions (first and second split axes) rather than sequentially along the optical axis, enabling compact packaging while maintaining wavelength stabilization functionality.
2Adaptability or versatility
If a wavelength tunable laser with SG-DBR and SG-DFB regions is used, then wavelength tuning capability is achieved, but the chip length becomes large and downsizing becomes difficult
Solution Approach 1:
The patent arranges the wavelength tunable laser components (SG-DBR, SG-DFB regions) and wavelength locker components in a two-dimensional plane using a beam splitter configuration. This spatial reorganization allows the extended chip structure to be packaged more compactly by utilizing lateral space rather than only linear extension along the optical axis.
3Reliability
If optical components such as a wavelength locker are combined on the output optical axis, then wavelength control functionality is achieved, but the packaging area increases
Solution Approach 1:
The patent uses a beam splitter to divide the optical path into multiple spatial directions (first and second split axes). The wavelength locker components are distributed across these different spatial dimensions rather than being concentrated along a single linear path, thereby reducing the required packaging area while maintaining full wavelength control functionality.
4Area of stationary object
If the beam splitter splits the input optical axis into two axes with different split angles, then compact design is achieved, but the optical component placement becomes more complex
Solution Approach 1:
The patent employs asymmetric split angles for the two split axes of the beam splitter. The first split angle and second split angle are deliberately made different to optimize the spatial arrangement of optical components, allowing compact packaging while managing placement complexity through deliberate asymmetric design rather than symmetric configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the length and packaging area of the laser device, making it more compact while maintaining the necessary optical performance, particularly suitable for wavelength tunable lasers with SG-DBR and SG-DFB regions.
Implementation Method 1
a beam splitter that splits an input optical axis into a first split axis having a first split angle and a second split axis having a second split angle
Implementation Method 2
an optical semiconductor element that has a first outputting end having a first output axis coupled optically to the input optical axis of the beam splitter, a second outputting end having a second output axis, and optical gain
Data Source
AI summary
An optical semiconductor device includes: a beam splitter that splits an input optical axis into a first split axis having a first split angle and a second split axis having a second split angle larger than the first split angle; a first unit that is located on the first split axis of the beam splitter and has one or more optical components, an interval between a more distant end of the first unit and the beam splitter having a first length; a second unit that is located on the second split axis of the beam splitter and has one or more optical components, an interval between a more distant end of the second unit and the beam splitter having a second length larger than the first length; and an optical semiconductor element that has a first outputting end having a first output axis coupled optically to the input optical axis of the beam splitter, a second outputting end having a second output axis, and optical gain, the optical semiconductor element being inclined so that the second output axis is arranged away to a side of the second split axis from the first output axis.