Optical Semiconductor Element Bonding via Connecting Portion

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Solution Overview

Problem

The existing methods for manufacturing optical semiconductor elements face challenges with unintended etching during the bonding process, which can damage the semiconductor element and reduce bonding strength.

Innovation Solution

The proposed solution involves a substrate with a silicon layer that includes a waveguide, a recess, a terrace, and a connecting portion. The semiconductor element, made of a III-V compound semiconductor, is bonded to these features and has a first tapered portion protruding in the direction of the waveguide. The connecting portion crosses the recess, blocking liquid entry and reducing unintended etching.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the semiconductor element is bonded to the silicon layer without a connecting portion crossing the recess, then the bonding process is simpler, but liquid enters the recess and causes unintended etching of the semiconductor element

Engineering Contradiction:

Improvebonding strengthVSAvoidstructure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The silicon layer is segmented into distinct functional regions: the waveguide for optical transmission, the recess for positioning, the terrace for support, and the connecting portion as a bridge structure. This segmentation allows each region to serve its specific function while collectively preventing liquid penetration and unintended etching.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The connecting portion acts as an intermediary structure that spans across the recess, blocking liquid from entering the recess and reaching the semiconductor element. This intermediary barrier prevents harmful liquid contact while maintaining the structural integrity and optical functionality of the device.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If the connecting portion is added to block liquid entry, then unintended etching is reduced, but the manufacturing process becomes more complex

Engineering Contradiction:

Improveetching controlVSAvoidmanufacturing process simplicity

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The connecting portion is formed as a pre-structured feature of the silicon layer before the semiconductor element is bonded. This preliminary formation of the blocking structure ensures that when liquid is introduced during bonding, it is already blocked from entering the recess, preventing unintended etching without requiring additional post-bonding steps.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The connecting portion is designed with specific geometric parameters (width, height, position) that optimize its blocking capability. By carefully controlling these parameters, the structure effectively blocks liquid while maintaining compatibility with standard manufacturing processes and material properties.

Inventive Principle:

Principle #35Parameter changes

3Loss of energy

If the semiconductor element is bonded directly without optimized taper shapes, then the bonding process is simpler, but light loss increases

Engineering Contradiction:

Improvelight lossVSAvoidtaper structure complexity

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The connecting portion and semiconductor element are designed with tapered (curved) surfaces rather than abrupt flat transitions. These curved taper shapes gradually transition the optical mode, reducing scattering and reflection losses at the interface while maintaining a manageable structural complexity.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces unintended etching of the semiconductor element, enhances bonding strength, and minimizes light loss by optimizing the taper shapes of the connecting portion and the semiconductor element.

Implementation Method 1

The connecting portion crosses the recess and is connected to the waveguide and the terrace. The semiconductor element is bonded on the waveguide, the recess, and the connecting portion

Methodology Applied

Scientific EffectPhysical barrier blocking:

Implementation Method 2

a semiconductor element made of a III-V compound semiconductor and bonded to the silicon layer

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS20250076591A1Optical semiconductor element and method of manufacturing optical semiconductor element

Publication Date: 2025.03.06 SUMITOMO ELECTRIC INDUSTRIES LTD

AI summary

An optical semiconductor element includes, a substrate having a silicon layer, and a semiconductor element made of a III-V compound semiconductor and bonded to the silicon layer. The silicon layer has a waveguide, a recess, a terrace, and a connecting portion. The recess is a recessed part lower than a surface of the waveguide, a surface of the terrace, and a surface of the connecting portion and is provided between the waveguide and the terrace. The semiconductor element is bonded on the waveguide, the recess, and the connecting portion and has a first tapered portion protruding in a direction in which the waveguide extends. The connecting portion crosses the recess and is connected to the waveguide and the terrace.