Optical Semiconductor Device With Integrated Logic Memory Sensor Dies
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Solution Overview
Problem
The scaling down of optical semiconductor devices poses challenges in achieving improved quality, yield, performance, and reliability while reducing complexity, particularly in signal processing and energy consumption.
Innovation Solution
The design incorporates a logic die with a memory die and a sensor die, utilizing inter-die and intra-die vias to simplify the sensor die's fabrication and reduce signal path length, allowing for efficient signal transfer to the logic die's functional circuits, and integrating the memory die for easier signal processing and storage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the sensor die integrates all signal processing circuits, then the device functionality is complete, but the fabrication complexity increases and yield decreases
Solution Approach 1:
The device is divided into separate functional dies: a sensor die that only contains optical sensing elements and a logic die that contains all signal processing circuits. This segmentation allows each die to be optimized independently, simplifying the sensor die fabrication process while maintaining complete signal processing capability through the logic die.
Solution Approach 2:
Inter-die vias serve as intermediaries to transfer signals from the sensor die to the logic die. These vias enable the separated functional blocks to communicate effectively, allowing the sensor die to remain simple while still achieving complete signal processing through the logic die via the intermediary connection.
2Adaptability or versatility
If the sensor die integrates all signal processing circuits, then the device functionality is complete, but the manufacturing yield decreases
Solution Approach 1:
By segmenting the device into a simple sensor die and a logic die, the manufacturing process for each die can be independently optimized. The sensor die requires only essential optical sensing fabrication steps, while the logic die handles complex circuit fabrication, thereby improving overall manufacturing yield compared to integrating all functions in a single complex die.
3Adaptability or versatility
If the signal path between sensor and logic circuits is long, then the device can be functionally complete, but the energy consumption increases
Solution Approach 1:
The sensor die and logic die are merged into a single integrated package with direct inter-die connections. This merging reduces the signal path length compared to separate packages, thereby reducing energy consumption while maintaining complete signal processing capability through the combined functional blocks.
4Productivity
If the optical semiconductor device is scaled down, then the computing ability increases, but the quality and reliability issues increase
Solution Approach 1:
Segmenting the device into specialized functional dies allows each die to be optimized for its specific function at appropriate size scales. The sensor die can be scaled down for high computing ability while the logic die maintains reliable signal processing, and the inter-die connections provide robust communication between the scaled components.
Data Source
AI summary
The present application discloses an optical semiconductor device. The optical semiconductor device includes a logic die, a memory die, and a sensor die. The logic die includes a front surface. The memory die includes a front surface positioned on the front surface of the logic die, and a back surface opposite to the front surface of the memory die. The sensor die includes a front surface positioned on the back surface of the memory die, a back surface opposite to the front surface of the sensor die, a sensor unit located at the back surface of the sensor die, a color filter positioned on the back surface of the sensor die, and a micro-lens positioned on the color filter.