Optical Semiconductor Device Meander Inductor Signal Attenuation
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Solution Overview
Problem
Optical semiconductor devices face challenges in efficiently transmitting high-frequency signals to semiconductor lasers, leading to attenuation in the high-frequency band, which affects the bandwidth and power consumption of optical transmission modules and transceivers.
Innovation Solution
The optical semiconductor device incorporates a meander inductor and a resistor with increased inductance, combined with a second bonding wire, to enhance the amplitude of the modulation signal and reduce attenuation, while maintaining a compact size, by positioning the inductor between the second bonding wire and the resistor, and using a capacitor to terminate the coplanar strip effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional signal waveguides (coplanar strips, microstrip lines) are used to transmit high-frequency signals to semiconductor lasers, then the basic signal transmission function is achieved, but significant attenuation occurs in the high-frequency band, limiting bandwidth and increasing power consumption
Solution Approach 1:
The patent introduces an inductor as an intermediary component inserted between the coplanar strip and the semiconductor laser chip. This inductor acts as a mediator that compensates for high-frequency signal attenuation by providing reactive impedance matching, thereby reducing energy loss and extending the usable bandwidth of the optical transmission module.
Solution Approach 2:
The patent modifies the electrical parameters of the signal transmission path by introducing an inductor with specific inductance value (e.g., 100 pH to 1 nH). This parameter change alters the impedance characteristics of the transmission line, enabling better high-frequency signal transmission and reducing attenuation effects that would otherwise limit bandwidth.
2Productivity
If the inductor is inserted between the coplanar strip and semiconductor laser chip, then high-frequency attenuation is reduced and bandwidth is improved, but the device size and structural complexity increase
Solution Approach 1:
The patent merges the inductor with existing structural elements of the optical transmission module. The inductor is integrated into the mounting structure or positioned within the existing package footprint, combining multiple functions (signal compensation and mechanical support) into a unified structure, thereby minimizing the increase in device complexity.
Solution Approach 2:
The patent utilizes the vertical dimension (thickness direction) of the module to position the inductor, rather than only expanding in the planar directions. By stacking components in the vertical dimension, the patent achieves the required inductance value without significantly increasing the lateral footprint of the device.
3Loss of energy
If the inductor is inserted between the coplanar strip and semiconductor laser chip, then high-frequency attenuation is reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent performs preliminary actions by pre-calculating and pre-selecting the optimal inductance value based on the specific application requirements (wavelength, power consumption, bandwidth). This preliminary design step simplifies the manufacturing process by eliminating the need for complex in-situ measurements and adjustments, allowing for straightforward component selection and assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases the inductance between the second bonding wire and the resistor, improving the bandwidth and reducing power consumption, enabling broadband optical semiconductor devices, modules, and transceivers with reduced high-frequency attenuation.
Implementation Method 1
an inductor provided on the first surface, the inductor being electrically connected between the first pattern and the second pattern
Implementation Method 2
a capacitor provided on the first surface, wherein the capacitor is electrically connected between the resistor and the grounding pattern
Implementation Method 3
the inductor being formed by a meander wiring or a bonding wire
Data Source
AI summary
An optical semiconductor device includes an insulative base having first and second surfaces, and a metallic pattern formed on the first surface and including a grounding pattern, a transmission pattern having a line connected between input and output ends thereof, and first and second patterns, where the first pattern is located between the second surface crossing a direction parallel to the first surface, and the second pattern. The device includes a laser chip, mounted on the first surface between the transmission pattern and the first and second patterns, and having an electrode and a light emitting end located between the electrode and the second surface, a first wire connecting the output end to the electrode, a second wire connecting the electrode to the first pattern, an inductor provided on the first surface connected between the first and second patterns and formed by a meander wiring or a bonding wire.