Optical Semiconductor Module Integrated Resin Assembly
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Solution Overview
Problem
The high cost and complexity of optical semiconductor modules, particularly in consumer and industrial equipment, stem from the need for precise assembly and multiple components, which increases material and manufacturing costs, and reduces reliability due to mechanical stress and assembly challenges.
Innovation Solution
An optical semiconductor module design that integrates an optical semiconductor element, a drive IC, and an electrode lead within a resin, with an interconnect layer for electrical connection, and a transparent resin for protection, allowing for simplified assembly and reduced component count, and using a lead frame with a plating treatment to minimize mechanical stress and enhance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple components (optical semiconductor element, drive IC, electrode lead) are assembled separately, then electrical connection and functionality are achieved, but assembly complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the optical semiconductor element, drive IC, and electrode lead into a single integrated module where these components are arranged and fixed together on a substrate. The interconnect layer integrates electrical connections between all components, eliminating the need for separate assembly steps and reducing overall device complexity while maintaining reliable electrical connections.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it holds the optical semiconductor element, mount the drive IC, support the electrode lead, and provide the base for the interconnect layer. This multi-functional substrate reduces the number of separate components needed and simplifies the overall assembly process.
2Manufacturing precision
If precise assembly is performed to achieve proper electrical connection, then functionality is ensured, but manufacturing cost and time increase
Solution Approach 1:
The optical semiconductor element, drive IC, and electrode lead are pre-arranged and pre-connected on the substrate before final module assembly. The interconnect layer is formed in advance to establish all necessary electrical pathways, reducing the precision requirements during final assembly and improving manufacturing efficiency.
3Reliability
If multiple separate components are used, then electrical connection is achieved, but material cost and component count increase
Solution Approach 1:
The patent combines multiple functional components (optical semiconductor element, drive IC, electrode lead) into a single integrated module structure. The interconnect layer provides electrical connections between all components within this unified structure, reducing the total component count and material usage while ensuring reliable electrical connectivity.
4Ease of manufacture
If traditional assembly methods are used, then components are connected, but mechanical stress and reliability issues arise
Solution Approach 1:
The patent changes the mechanical parameters of the assembly by using a flexible interconnect layer that can accommodate thermal expansion and mechanical stress. The interconnect layer is designed with appropriate thickness and material properties to absorb stress without compromising electrical connections, improving reliability while maintaining ease of manufacture.
Data Source
AI summary
According to one embodiment, an optical semiconductor module is disclosed. The module includes an optical semiconductor. An electrode lead is arranged apart from the optical semiconductor element. A resin holds the optical semiconductor element and the electrode lead. An interconnect layer electrically or functionally connects the optical semiconductor element and the electrode lead. The optical semiconductor element and the electrode lead are embedded in the same surface side of the resin. A part of the interconnect layer is directly provided on the resin or provided on the resin via an insulating layer.