Optical Semiconductor Mold Base with Air-Vents for Uniform Heating
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Solution Overview
Problem
Traditional packaging methods for optical-electronic semiconductors, such as LEDs, face limitations in production efficiency due to the inability to handle multiple LEDs in a single row, deformation of plastic members causing misalignment, and poor heat exchange leading to inaccurate heating.
Innovation Solution
A packaging apparatus comprising a mold base with air-vents for uniform heating and a fixing member to maintain precise positioning of supporting members, allowing for multiple LEDs to be packaged simultaneously while ensuring even heat distribution and preventing off-centering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional mold is used to package LEDs, then the packaging process can be completed, but the production rate is limited because the mold only receives one row of LEDs
Solution Approach 1:
The mold base is divided into multiple cavities arranged in multiple rows and columns, allowing simultaneous packaging of multiple LEDs. Each cavity functions as an independent packaging unit, enabling parallel processing and significantly increasing production rate without requiring multiple separate molds.
2Ease of manufacture
If plastic members are used to hold connection metal, then the packaging process can proceed, but the plastic members deform gradually due to friction and usage causing the connection metal to become off center
Solution Approach 1:
The supporting members are changed from plastic material to metal material, fundamentally altering the mechanical properties. Metal supporting members have higher strength and resistance to deformation, maintaining precise positioning of connection metal throughout the packaging process and preventing off-centering issues.
3Device complexity
If enclosed mold is used for packaging, then the packaging structure is simple, but the heated air cannot reach the LED body directly resulting in poor heat exchange and low heating accuracy
Solution Approach 1:
The mold structure is changed from an enclosed design to an open design, extracting the top cover to allow direct access of heated air to the LED bodies. This enables efficient heat exchange and uniform heating during the curing process, significantly improving heating accuracy.
4Ease of manufacture
If traditional packaging method is used, then the process can be completed, but there is temperature difference between LED body and furnace leading to poor heat exchange control
Solution Approach 1:
The mold design transitions from a closed three-dimensional enclosed structure to a two-dimensional open structure with air-vents. This dimensional change allows heated air to flow through the mold base and directly contact LED bodies from below, eliminating temperature differences and achieving uniform heating throughout the curing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances production efficiency by enabling simultaneous packaging of multiple LEDs, improves heating uniformity, and maintains precise positioning, resulting in improved curing quality and reduced costs.
Implementation Method 1
at least one first air-vent formed on the bottom of the mold base so that the heated air can flow to contact the molding bodies
Data Source
AI summary
A packaging apparatus for optical-semiconductors includes a mold base having a longitudinal receiving space, an encapsulating module attached to the mold base, and a fixing member attached to the encapsulating module. The bottom of the mold base has at least one air-vent and the mold base has a predetermined width. The encapsulating module includes a plate engaged with the mold base, a plurality of molding bodies penetrating the plate and received in the receiving space, and a plurality of supporting members connected to the molding bodies. The fixing member has a plurality of holding slots to hold the supporting members so that the supporting members are more stable. Furthermore, the width of the mold base is optimized with the dimension of a furnace so that the production rate is increased and the stability of the packaging structure is improved.