Optical Semiconductor Encapsulation via Phosphor-White Ink Layering
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for producing encapsulating layer-covered optical semiconductor elements result in low dimension stability and optical stability due to uneven phosphor distribution, leading to inconsistent light emission and efficiency among LEDs.
Innovation Solution
A method involving the precise application and curing of a phosphor layer to cover optical semiconductor elements, allowing for accurate cutting and exposure of one surface, followed by the inclusion of a reflector portion and curable resin to enhance dimension and luminous stability, and improve production efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If ceramic ink with phosphor is applied and temporarily cured to cover LEDs, then phosphor distribution is improved, but position confirmation becomes difficult and dicing accuracy deteriorates
Solution Approach 1:
The patent applies a white ink layer containing phosphor particles to the LED surface before applying the ceramic ink. This preliminary application of white ink creates a high-contrast background that enables accurate position confirmation and dicing. The white ink is temporarily cured to fix the phosphor particles in place, ensuring uniform phosphor distribution while maintaining visibility for subsequent processing steps.
Solution Approach 2:
The white ink layer acts as an intermediary between the LED surface and the ceramic ink. It serves multiple functions: providing a reflective background for position confirmation, enabling uniform phosphor distribution, and maintaining visibility during the dicing process. This intermediary layer resolves the contradiction by allowing both good phosphor distribution and accurate dicing to coexist.
2Productivity
If dicing is performed on temporarily cured ceramic, then individual LEDs are separated, but dimension stability deteriorates due to inaccurate cutting
Solution Approach 1:
The white ink layer is applied and temporarily cured before dicing to establish clear visual boundaries for accurate cutting. This preliminary preparation ensures that subsequent dicing operations can be performed with high precision, maintaining dimension stability while enabling efficient mass production through batch processing.
3Reliability
If phosphor layer is applied to improve emission consistency, then luminous efficiency improves, but process complexity increases
Solution Approach 1:
The patent combines the phosphor application and ceramic coating steps into a single integrated process. The white ink containing phosphor particles is applied first, then ceramic ink is applied over it, and both are temporarily cured together. This merging of steps achieves consistent emission characteristics while avoiding the need for separate, complex processing stages.
Solution Approach 2:
The invention uses a composite structure consisting of a white ink layer containing phosphor particles and a ceramic ink layer. This composite material approach allows the phosphor to be uniformly distributed while the ceramic provides structural integrity and optical properties, achieving reliable emission consistency through material composition rather than complex processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves excellent dimension and luminous stability, ensuring consistent light emission and improved efficiency of optical semiconductor devices by allowing accurate cutting and encapsulation of optical semiconductor elements with a phosphor layer and reflector portion.
Implementation Method 1
the encapsulating layer contains a curable resin; in the covering step, the optical semiconductor element is covered with the encapsulating layer that is in a B-stage state; and after the covering step, an encapsulating step in which the encapsulating layer is cured to be brought into a C-stage state
Data Source
AI summary
A method for producing an encapsulating layer-covered optical semiconductor element includes a disposing step of disposing an encapsulating layer at one side in a thickness direction of a support and a covering step of, after the disposing step, covering an optical semiconductor element with the encapsulating layer so as to expose one surface thereof to obtain an encapsulating layer-covered optical semiconductor element.