Optical Semiconductor Sealing Structure Preventing Brazing Extrusion
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Solution Overview
Problem
Existing optical semiconductor apparatuses face challenges in achieving reliable sealing and high manufacturing yield due to extrusion of brazing filler metal during the bonding process, which can lead to short circuits and reduced light emission efficiency.
Innovation Solution
The apparatus includes a package substrate with a recess, a glass window member, and a sealing structure featuring a first metal layer on the substrate, a second metal layer on the frame body, and a metal bonding part between them, with the metal bonding part being positioned on the inner circumferential surface to prevent extrusion towards the recess, using a gold-tin (AuSn) alloy for bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a load is applied to the brazing filler metal during bonding to improve bonding quality, then the sealing quality is improved, but the brazing filler metal may extrude and flow toward the packaging surface causing short circuits
Solution Approach 1:
The patent introduces a sealing structure with a sealing surface that acts as an intermediary between the substrate and lid body. This sealing surface provides a dedicated path for brazing filler metal extrusion, preventing it from flowing toward the packaging surface where it could cause short circuits. The sealing structure mediates the bonding process by controlling metal flow while maintaining bonding quality.
Solution Approach 2:
The patent extracts the harmful extruded brazing filler metal from the problematic area by providing a sealing surface that directs it away from the packaging surface. The sealing structure separates the bonding function from the packaging surface area, allowing metal extrusion to occur in a controlled region that does not compromise electrical isolation.
2Productivity
If the sealing structure prevents metal extrusion, then manufacturing yield is improved, but bonding quality may be compromised without proper load application
Solution Approach 1:
The sealing surface acts as an intermediary that allows both bonding quality and manufacturing yield to be achieved. It provides a controlled path for metal extrusion that does not interfere with the bonding process, enabling load application for quality bonding while preventing harmful metal flow that would reduce yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances manufacturing yield and achieves a highly reliable sealing structure by preventing metal extrusion into the recess, ensuring effective light emission and reducing the risk of short circuits.
Implementation Method 1
bonding the substrate and the lid body via a brazing filler metal
Data Source
AI summary
A light emitting apparatus includes: a package substrate; a light emitting device housed in a recess of the package substrate; a window member provided to cover an opening of the recess; and a sealing structure that seals a space between the package substrate and the window member. The window member includes a glass plate having an inner surface that faces the optical semiconductor device and a frame body provided on the inner surface of the glass plate. The sealing structure includes a first metal layer provided on a top surface of the package substrate, a second metal layer provided on a bottom surface and an inner circumferential surface of the frame body, and a metal bonding part provided between the first and second metal layers, at least a portion of the metal bonding part being provided on the inner circumferential surface.