Optical Semiconductor Device Segmented Conductive Patterns

Solution Overview

Problem

The miniaturization of optical semiconductor devices has made it difficult to accurately contact probes with small conductive patterns on the carrier surface, leading to short circuits during testing due to the narrow gaps and low positional accuracy, especially when multiple bonding pads are adjacent.

Innovation Solution

The optical semiconductor device incorporates separated conductive patterns with distinct bonding pads and mounting areas, allowing for precise probe contact without short circuits, and includes a capacitor for electrical connection after testing, enabling improved signal transfer characteristics and reduced device size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the device is miniaturized, then the device size is reduced, but the gap between conductive patterns becomes narrower making probe contact difficult

Engineering Contradiction:

Improvedevice sizeVSAvoidprobe contact precision

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The conductive patterns are segmented into distinct first, second, and third conductive patterns with separate functions. The first conductive pattern connects to the light receiving element, the second connects to the capacitor, and the third serves as a bonding pad. This segmentation allows each pattern to be optimally positioned and sized, preventing short circuits while maintaining miniaturization.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The conductive patterns are arranged in different spatial dimensions on the carrier surface. The first bonding pad and second bonding pad are positioned at opposite ends of the carrier, utilizing the two-dimensional surface space efficiently. This dimensional arrangement increases the effective gap between conductive patterns without increasing the overall device footprint.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Device complexity

If multiple bonding pads are placed adjacent to each other, then the device complexity is reduced, but short circuits occur during testing due to narrow gaps

Engineering Contradiction:

Improveconductive pattern configurationVSAvoidtesting reliability

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The conductive patterns are segmented into distinct first, second, and third conductive patterns with separate functions. The first conductive pattern connects to the light receiving element, the second connects to the capacitor, and the third serves as a bonding pad. This segmentation allows each pattern to be optimally positioned and sized, preventing short circuits while maintaining miniaturization.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The dielectric carrier acts as an intermediary between the conductive patterns, providing electrical isolation. The carrier's dielectric properties prevent direct electrical contact between the first, second, and third conductive patterns, eliminating short circuit risks during testing while allowing close spatial positioning for compact design.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Volume of moving object

If the gap between conductive patterns is narrowed, then the device size is reduced, but positional accuracy during probe contact deteriorates

Engineering Contradiction:

Improvedevice sizeVSAvoidprobe positioning accuracy

Core Design Contradiction:

Volume of moving objectVSMeasurement precision

Solution Approach 1:

The conductive patterns are arranged in different spatial dimensions on the carrier surface. The first bonding pad and second bonding pad are positioned at opposite ends of the carrier, utilizing the two-dimensional surface space efficiently. This dimensional arrangement increases the effective gap between conductive patterns without increasing the overall device footprint.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Different regions of the carrier surface are assigned different functional qualities. The first bonding pad region is optimized for light receiving element connection, the second bonding pad region for capacitor connection, and the dielectric regions provide electrical isolation. This local differentiation allows precise probe contact at each location while maintaining overall device compactness.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS11482559B2Optical semiconductor device and method of assembling optical semiconductor device

Publication Date: 2022.10.25 SUMITOMO ELECTRIC DEVICE INNOVATIONS

AI summary

An optical semiconductor device includes a semiconductor light receiving element, a capacitor, and a carrier. The carrier has a mounting surface on which the semiconductor light receiving element and the capacitor are mounted. The optical semiconductor device includes a first conductive pattern including a first mounting area and a first bonding pad, a second conductive pattern including a second mounting area and a third mounting area, and a third conductive pattern including a second bonding pad. The first mounting area is connected to a first electrode of the semiconductor light receiving element. The second mounting area is connected to a second electrode of the semiconductor light receiving element. The third mounting area is connected to one electrode of the capacitor. The conductive patterns are separated from each other. The other electrode of the capacitor is electrically connected to the third conductive pattern via a wire.