Optical Semiconductor Device Thickness Control
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Solution Overview
Problem
Existing modulator-integrated semiconductor lasers face challenges in reducing internal losses and maintaining coupling efficiency due to differences in thickness between the active layer and the optical waveguide layer, leading to light reflection and reduced coupling efficiency at the connection interface between the semiconductor laser and modulator parts.
Innovation Solution
A manufacturing method that forms unevenness on the semiconductor substrate to control the thickness of the optical waveguide layer, ensuring it is thicker than the active layer while minimizing step formation at the interface, by using a mask pattern with varying ratios of projection to depression along the optical waveguide direction, allowing for a gradual thickness transition and preventing large step formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the optical waveguide layer is made thicker in the modulation area to reduce internal losses, then light reflection increases at the connection interface due to thickness difference, but making it thinner reduces coupling efficiency
Solution Approach 1:
The patent transitions from a uniform thickness design to a graded thickness profile by introducing intermediate layers with varying thicknesses between the active layer and the optical waveguide layer. This dimensional variation in the thickness parameter allows the optical waveguide layer to be thicker overall while maintaining a gradual transition at the connection interface, thereby reducing light reflection caused by abrupt thickness changes.
Solution Approach 2:
The patent applies different thickness characteristics to different regions: the optical waveguide layer is made thicker in the modulation area to reduce internal losses, while intermediate layers are designed with gradually varying thicknesses at the connection interface to minimize reflection. This local differentiation of thickness quality resolves the contradiction between reducing energy loss and preventing harmful reflection.
2Reliability
If the optical waveguide layer thickness is increased to improve modulation performance, then coupling efficiency degrades due to step formation at the interface
Solution Approach 1:
The patent divides the transition region between the active layer and optical waveguide layer into multiple intermediate layers with progressively varying thicknesses. This segmentation of the thickness transition prevents the formation of a single large step, thereby maintaining coupling efficiency while allowing the optical waveguide layer to be thicker for improved modulation performance.
Solution Approach 2:
By introducing intermediate layers with graded thicknesses, the patent creates a multi-dimensional thickness profile rather than a simple binary transition. This dimensional approach allows the optical waveguide layer to achieve greater thickness for better modulation performance while the intermediate layers provide a gradual transition that preserves coupling efficiency.
Data Source
AI summary
A manufacturing method for an optical semiconductor device includes: forming a first semiconductor layer; forming a first mask pattern on the first semiconductor layer in a first area where an electro absorption type modulator is formed; forming an unevenness along the first direction on the first semiconductor layer; forming a second semiconductor layer on the unevenness; and forming an optical waveguide layer on the second semiconductor layer. The first mask pattern includes a first pattern in the first area and a second pattern in a second area where a DFB laser is formed, the first pattern including a first opening pattern and a first cover pattern, and the second pattern including a second opening pattern and a second cover pattern, and a ratio of the first opening pattern to the first cover pattern is different from that of the second opening pattern to the second cover pattern.


