Semiconductor Package Optical Device Wire Bonding Elimination
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Solution Overview
Problem
Conventional semiconductor packages with optical devices require wire bonding and use two transparent substrates, increasing complexity and production costs.
Innovation Solution
A semiconductor package design that eliminates wire bonding by using a transparent substrate with first and second contacts, a chip with third contacts, and a carrier substrate with a receiving space and fourth contacts, allowing electrical connection without wires and using only one transparent substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to electrically connect chip-contacts to substrate-contacts, then electrical connectivity is achieved, but device complexity and production cost increase
Solution Approach 1:
The patent merges the functions of the substrate and carrier substrate by making the substrate transparent and integrating both chip mounting and optical device housing functions into a single component. This eliminates the need for separate wire bonding processes and reduces packaging complexity while maintaining electrical connectivity through direct contact between chip-contacts and substrate-contacts.
2Reliability
If two transparent substrates (carrier substrate and glass substrate) are used, then the optical device is properly accommodated and sealed, but manufacturing complexity and production cost increase
Solution Approach 1:
The patent combines the functions of the carrier substrate and glass substrate into a single transparent substrate. This substrate simultaneously serves as the mounting platform for the chip, the housing for the optical device, and the sealing element. This merging reduces manufacturing complexity and production cost while maintaining proper accommodation and sealing of the optical device.
Solution Approach 2:
The transparent substrate is designed to perform multiple functions: it acts as the carrier for the chip, provides structural housing for the optical device, and serves as the sealing element. This multi-functionality eliminates the need for separate carrier substrate and glass substrate, simplifying the manufacturing process while maintaining reliability.
3Strength
If two transparent substrates are used, then structural support and sealing are provided, but production cost increases
Solution Approach 1:
The patent merges two separate transparent substrates into one integrated transparent substrate that provides both structural support and sealing functions. This reduction in the number of substrates from two to one decreases production cost while maintaining the necessary structural integrity and sealing capability through the multi-functional design.
Data Source
AI summary
A semiconductor package having an optical device and the method of making the same, includes a transparent substrate, a chip, an optical device and a carrier substrate. The transparent substrate has a plurality of first contacts and second contacts, wherein the first contacts are electrically connected to the second contacts. The chip is connected to the transparent substrate and forms a gap therebetween. The chip has a plurality of third contacts that are electrically connected to the first contacts. The optical device is disposed in the gap. The carrier substrate has a receiving space and a plurality of fourth contacts, wherein the receiving space accommodates the chip and the optical device, and the fourth contacts are electrically connected to the second contacts of the transparent substrate. Therefore, no connecting wires are needed and the step of wire bonding is omitted. Also, only one transparent substrate is used in the semiconductor package.