Optical Sensing Module With Transparent EMI Shielding Layer
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Solution Overview
Problem
The integration of optical sensing modules under thin, full-screen electronic devices leads to signal interference issues due to electrical noise and optical interference, affecting the accuracy of optical signal recognition.
Innovation Solution
An optical sensing module with a transparent conducting layer that shields interference signals by connecting to a ground wire, reducing signal interference between the optical sensing module and other modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the optical sensing module is integrated under the screen module, then the device achieves a thinner profile and full-screen design, but electrical noise interference is generated between the screen module and optical sensing module
Solution Approach 1:
A transparent conducting layer is introduced as an intermediary between the screen module and the optical sensing module. This layer serves as a shielding element that blocks electrical noise interference from the screen module while allowing optical signals to pass through to the sensing region, thus resolving the contradiction between integration and interference
Solution Approach 2:
The harmful electrical noise interference is extracted and directed to a ground wire. The transparent conducting layer is electrically connected to a ground wire in the substrate, which channels the interference signals away from the optical sensing module, effectively removing the harmful factor while maintaining the integrated design
2Adaptability or versatility
If the optical sensing module is integrated with the screen module, then system integration is improved, but signal interference between subsystems increases
Solution Approach 1:
The transparent conducting layer acts as a mediator that enables coexistence of the screen module and optical sensing module in close proximity. It provides electromagnetic shielding to protect the optical sensing module from electrical noise generated by the screen module, thus maintaining reliable signal transmission while achieving high system integration
Solution Approach 2:
The solution uses a composite structure combining transparent conducting layer with light-transmitting encapsulation material. This composite approach allows the shielding layer to block electrical interference while the transparent encapsulation material allows optical signals to pass through, resolving the signal interference issue while maintaining integration
3Use of energy by moving object
If transparent encapsulation is used for the optical sensing module, then optical signal transmission is enabled, but optical interference from light reflection inside the encapsulation occurs
Solution Approach 1:
The light-transmitting encapsulation layer is designed with specific local properties: it is transparent to allow optical signals to reach the sensing region, but its configuration and the presence of the transparent conducting layer create localized shielding effects that reduce optical interference from reflections, thus enabling both functions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The transparent conducting layer effectively shields interference signals, improving the accuracy of electrical signals generated by the optical sensing module.
Implementation Method 1
the transparent conducting layer is electrically connected to a ground wire in the substrate; the transparent conducting layer is configured to shield an interference signal from the one or more optical sensing chips
Implementation Method 2
the one or more optical sensing chips are configured to generate a corresponding electrical signal based on an optical signal transmitting through the transparent conducting layer and the light-transmitting layer
Data Source
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AI summary
An optical sensing module and an electronic device are provided. The optical sensing module comprises: a substrate, a light shielding layer, one or more optical sensing chips, a light-transmitting layer, and a transparent conducting layer; the one or more optical sensing chips are arranged above the substrate; the light shielding layer clads a portion of the one or more optical sensing chips without contacting the substrate and the light-transmitting layer, and clads a portion of the light-transmitting layer that excludes a second surface of the light-transmitting layer and an area not in contact with the one or more optical sensing chips; the transparent conducting layer is in contact with the second surface of the light-transmitting layer, and is electrically connected to a ground wire in the substrate; and the transparent conducting layer is configured to shield an interference signal from the one or more optical sensing chips.