Optical Sensing Module With Segmented Light Chambers
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Solution Overview
Problem
Conventional optical sensing modules have inefficient light emission due to separate packaging of light-emitting and light-receiving chips, leading to unreliable signal reading.
Innovation Solution
An optical sensing module with multiple light-emitting chips and a single light-receiving chip on the same substrate, enclosed by encapsulants in chambers with a metal reflecting layer, enhancing light emission efficiency and signal stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple light-emitting chips are integrated on the same substrate, then light emission efficiency is improved, but device complexity increases
Solution Approach 1:
The device is segmented into multiple independent light-emitting chips, each capable of emitting light in different colors. These chips are arranged on the same substrate and each is enclosed in its own chamber, allowing parallel operation and improved light emission efficiency while maintaining manageable complexity through modular design
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for mounting multiple light-emitting chips, electrical connection through wire bonding, and structural integration with the cover and chambers. This multi-functionality reduces the need for additional components and simplifies the overall device structure
2Ease of manufacture
If separate packaging of light-emitting and light-receiving chips is performed, then ease of manufacture is improved, but light emission efficiency deteriorates
Solution Approach 1:
The light-emitting chips and light-receiving chip are mounted on the substrate and wire-bonded to electrical connections before the cover is attached. The chambers are formed and reflecting layers are applied in advance, allowing subsequent encapsulant filling to be a simple single-step process. This preliminary arrangement of components maintains ease of manufacture while enabling integrated high-efficiency operation
3Ease of operation
If encapsulants are introduced through light-emitting holes and light-receiving hole, then ease of operation is improved, but loss of substance increases
Solution Approach 1:
The light-emitting holes and light-receiving hole serve dual purposes: they allow light to pass through for the sensing function, and they serve as access channels for introducing encapsulants to seal the chambers. By extracting the sealing function from a separate process step and integrating it with the existing optical apertures, the method improves ease of operation while minimizing material loss by using the same openings for both purposes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves light emission efficiency and stabilizes signal reading by allowing multiple light-emitting chips to emit light in different colors, ensuring precise light reception and processing.
Implementation Method 1
The plurality of light-emitting chips is disposed on the substrate and in the first chambers, respectively, to emit light beams in different colors
Implementation Method 2
The light-receiving chip is disposed on the substrate and in the second chamber to convert the received light beams into electrical signals to be processed
Implementation Method 3
the surfaces of the first chambers are coated with a metal reflecting layer, so as to enhance the efficiency of light emission of the light-emitting chips
Data Source
AI summary
An optical sensing module includes a substrate, a cover, a plurality of light-emitting chips, a light-receiving chip, and a plurality of encapsulants. The cover is disposed on the substrate. A plurality of first chambers and a second chamber are formed between the cover and the substrate. The cover has a plurality of light-emitting holes communicating with the first chambers, respectively, and a light-receiving hole communicating with the second chamber. The light-emitting chips are disposed on the substrate and in the first chambers, respectively. The light-receiving chip is disposed on the substrate and in the second chamber. The encapsulants fill the first and second chambers and enclose the light-emitting chips and the light-receiving chip, respectively. Hence, characterized in that: the light-emitting chips and the light-receiving chip are disposed on the substrate, and the light-emitting chips emit light beams in different colors to enhance light emission efficiency.