Optical Sensing Package Structure for Miniaturized IR Detection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing temperature sensors are limited by the size of their metal covers, making them difficult to comply with the trend towards miniaturization and are costly due to complex manufacturing processes.
Innovation Solution
A sensing package structure that includes a substrate, a sensor, and an optical element with a first blocking layer having a first opening, allowing radiation to pass through and eliminating the need for a metal cover, thereby reducing overall size and allowing adjustment of the field of view.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal cover is used to cover the chip package structure, then the sensor provides firm protection and proper radiation reception, but the overall size exceeds 2mm height and manufacturing process becomes complex and costly
Solution Approach 1:
The patent removes the metal cover from the sensor structure entirely, extracting only the essential protective and radiative functions. The chip package is exposed without a metal cover, eliminating the height constraint while maintaining operational reliability through alternative structural arrangements.
Solution Approach 2:
The patent segments the protective function from the radiative function. Instead of using a single metal cover for both protection and radiation reception, the design separates these functions into different structural elements, allowing the protective function to be minimized while preserving radiation reception capabilities.
2Reliability
If a metal cover with opening and optical filter is used, then radiation reception is enabled, but multiple manufacturing processes (stamping, ultrasonic welding, electroplating) are required
Solution Approach 1:
The patent extracts and eliminates the metal cover component entirely from the manufacturing process. By removing this component, all associated manufacturing processes (stamping, ultrasonic welding, electroplating) are eliminated, significantly simplifying production while maintaining radiation reception through the optical filter alone.
Solution Approach 2:
The patent merges the functions of the metal cover and optical filter into a simplified structure where the optical filter serves as the primary radiative component without requiring integration with a metal cover. This consolidation reduces the number of manufacturing steps and assembly operations required.
3Strength
If a metal cover is used for the sensor, then structural integrity is maintained, but the sensor cannot comply with thin, lightweight, and miniaturized design trends
Solution Approach 1:
The patent extracts the metal cover from the design, removing the source of excessive thickness. The structural integrity previously provided by the metal cover is redistributed to other structural elements that do not add height, enabling the sensor to meet thin and miniaturized design requirements while maintaining necessary strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the overall size of the temperature sensor, eliminates the need for complex and costly metal cover manufacturing, and allows for adjustable field of view to achieve appropriate detection distances.
Implementation Method 1
The first light-permeable layer is disposed on the first surface. A first blocking layer is disposed on the first light-permeable layer. The optical element transmits specific wavelengths of radiation while blocking others through the selective permeability of these layers
Implementation Method 2
The sensor has a sensing region for receiving an infrared. A radiation that enters the first opening passes through the optical element and is received by the sensor
Data Source
AI summary
A sensing package structure includes a substrate, a sensor, an optical element, and a first blocking layer. The sensor is disposed on the substrate. The optical element is disposed above the sensor. The first blocking layer is disposed on the optical element. The first blocking layer has a first opening, and an aperture of the first opening is greater than a thickness of the optical element. A radiation that enters the first opening passes through the optical element and is received by the sensor.