Optical Sensing Device Openings for Lower Stray Capacitance
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Solution Overview
Problem
Existing optical sensing devices face challenges in improving sensitivity due to limitations in miniaturization and reduction of equivalent capacitance, which affects the performance of the sensing elements.
Innovation Solution
A method of manufacturing a sensing device involves forming openings in the planarization layer using different processes, such as exposure and development for one opening and etching for another, to achieve miniaturization of the sensing element and reduce stray capacitance, thereby enhancing sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the sensing device is miniaturized to reduce equivalent capacitance, then sensitivity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent divides the opening formation process into two separate steps: first forming a large opening in the planarization layer, then forming a second opening in the light-shielding layer. This segmentation allows each opening to be formed with appropriate precision for its specific requirements, avoiding the need to form one extremely small opening with extremely high precision requirements.
Solution Approach 2:
The patent transitions from forming a single small opening in one layer to forming openings in multiple stacked layers. By distributing the opening formation across different vertical dimensions (planarization layer and light-shielding layer), the patent achieves effective miniaturization while managing manufacturing precision requirements through sequential processing.
2Adaptability or versatility
If different processes are used to form openings, then manufacturing flexibility is improved, but process complexity increases
Solution Approach 1:
The patent applies different etching processes to different locations and layers: a first etching process for the planarization layer opening and a second etching process for the light-shielding layer opening. Each process is optimized for its specific layer and requirements, allowing flexible adaptation to different manufacturing needs while managing overall complexity through localized process optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves the sensitivity and overall performance of the sensing device by reducing equivalent capacitance and enabling miniaturization of the sensing elements.
Implementation Method 1
The sensing element in an optical sensing device converts received light into an electrical signal
Data Source
AI summary
A method of manufacturing a sensing device includes: providing a substrate; forming a circuit element on the substrate; forming a sensing element on the substrate; forming a planarization layer on the sensing element and the circuit element; forming a first opening in the planarization layer, wherein the first opening overlaps with the circuit element; and forming a second opening in the planarization layer, wherein the second opening overlaps with the sensing element. In addition, the first opening and the second opening are formed by different processes.