Integrated Optical Sensor and Charging Module for Slim Wearables
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Solution Overview
Problem
Wearable electronic devices face design limitations due to space constraints, particularly when integrating biosensor and wireless charging modules, leading to increased thickness and complexity in assembly processes.
Innovation Solution
An integrated module assembly is formed by combining an optical sensor module and a wireless charging module with a flexible printed circuit board, allowing them to be electrically connected and housed within the device, reducing thickness and simplifying assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the biosensor module and wireless charging module are implemented as separate stacked arrangements, then each module can be independently designed and assembled, but the overall device thickness increases and assembly complexity increases
Solution Approach 1:
The patent integrates the optical sensor module and wireless charging module into a single module assembly that shares common structural elements. The FPCB serves as a common substrate for both modules, and the housing structure accommodates both functions within the same spatial envelope, eliminating the need for separate stacked arrangements and reducing overall device thickness.
Solution Approach 2:
The module assembly is designed to perform multiple functions simultaneously - optical sensing (light emitting and receiving parts) and wireless charging (coil structure) - within a single integrated unit. This multi-functional design allows both biosensor and wireless charging capabilities to coexist without requiring separate dedicated spaces, thereby reducing device thickness while maintaining ease of manufacture through standardized assembly procedures.
2Ease of manufacture
If the biosensor module and wireless charging module are implemented as separate stacked arrangements, then each module can be independently designed, but the assembly process becomes more complex with additional connecting structures
Solution Approach 1:
The patent combines the optical sensor module and wireless charging module into a single integrated assembly that shares common structural elements including the FPCB and housing. This merging eliminates the need for multiple separate connecting structures and assembly steps, reducing assembly process complexity while preserving independent design capabilities for each functional module within the unified structure.
3Adaptability or versatility
If separate module arrangements are used, then design flexibility is maintained, but interior space for other components is reduced
Solution Approach 1:
The integrated module assembly performs multiple functions (optical sensing and wireless charging) within a single compact unit, maximizing the use of available interior space. This multi-functional design maintains design flexibility by allowing independent optimization of each module's internal layout while preserving valuable interior volume for other device components through efficient spatial arrangement.
Solution Approach 2:
The optical sensor module components (light emitting part, light receiving part on FPCB) are arranged in a nested or closely integrated configuration within the housing, with the wireless charging coil surrounding or adjacent to the FPCB. This nesting approach minimizes the overall footprint of the module assembly, freeing up interior space for other components while maintaining design flexibility for each individual module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration reduces the overall device thickness, enhances interior space for other components, lowers manufacturing costs, and simplifies the assembly process, thereby reducing potential defects.
Implementation Method 1
the light emitting part emits light in the second direction, and the light receiving part receives emitted light reflecting off the external object
Implementation Method 2
a wireless charging module surrounding the FPCB of the optical sensor module
Data Source
AI summary
An electronic device is disclosed, including a housing having a front plate, a back plate facing the front plate, and a side frame surrounding a space defined between the front and back plates, a circuit board disposed within the housing, a module assembly disposed between the circuit board and the back plate, and electrically connected with the circuit board, wherein the module assembly includes: an optical sensor module including a flexible printed circuit board (FPCB) including a first surface and a second surface facing away from the first surface, a light emitting part disposed on the first surface of the FPCB, and a light receiving part disposed on the first surface spaced apart from the light emitting part, and a wireless charging module surrounding the FPCB of the optical sensor module, and at least partially coupled to the FPCB so as to be integrated with the FPCB.