Optical Sensor Chip Mounting with Opaque Protective Plate
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Solution Overview
Problem
Current methods for mounting integrated circuit chips with optical sensors on substrate plates do not effectively protect the sensors from external light radiation and secure electrical connections, leading to potential damage and reliability issues.
Innovation Solution
An electronic device design featuring an integrated circuit chip with an optical sensor mounted on one side and an opaque protective plate, positioned within a traversing passage on the substrate plate, along with encapsulation material and electrical connections, which are thermocompressed and hardened to form a secure and protective block, while also incorporating a filter plate to manage external light exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the optical sensor is mounted on the opposite side from the substrate plate, then the sensor is exposed to external light radiation, but the device structure is simpler
Solution Approach 1:
The patent inverts the conventional mounting arrangement by positioning the optical sensor on the same side as the substrate plate mounting surface, rather than on the opposite side. This inversion allows the sensor to be protected by the substrate plate and encapsulation structure while maintaining a compact design. The protective plate is positioned above the sensor, creating a layered structure that shields the sensor from external light radiation.
Solution Approach 2:
The patent employs a nested structure where the optical sensor is positioned within a cavity or recess in the substrate plate, and the protective plate is nested above the sensor. The encapsulation material is then applied to enclose these nested components. This nesting approach provides effective protection from external light radiation while maintaining a compact overall device structure.
2Object-affected harmful factors
If the protective plate is positioned close to the optical sensor, then the sensor is better protected, but electrical connection elements are harder to interpose
Solution Approach 1:
The patent segments the protective structure by positioning the protective plate at a specific distance from the optical sensor, creating spatial separation. This segmentation allows electrical connection elements to be interposed between the sensor and the protective plate, facilitating easier assembly and manufacturing while still providing adequate protection. The encapsulation material is applied to fill the space and secure all components in their respective positions.
3Ease of manufacture
If the chip is mounted with the sensor facing the substrate plate, then electrical connections are easier to make, but the sensor is not protected from external light
Solution Approach 1:
The patent inverts the conventional mounting orientation by positioning the optical sensor on the same side as the substrate plate mounting surface, rather than on the opposite side. This inversion allows the sensor to be protected by the substrate plate and encapsulation structure while maintaining a compact design. The protective plate is positioned above the sensor, creating a layered structure that shields the sensor from external light radiation.
Solution Approach 2:
The patent employs a composite structure combining the substrate plate, protective plate, and encapsulation material to provide both mechanical support and protection from external light radiation. This composite approach allows the sensor to be mounted in a position that facilitates electrical connections while simultaneously protecting it from harmful light exposure through the combined protective effect of multiple materials and layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides robust protection for the optical sensor, ensures secure electrical connections, enhances mechanical strength, and reduces device thickness, while effectively filtering external light radiation to prevent damage.
Implementation Method 1
hardening the encapsulation material in order to obtain a block
Implementation Method 2
welded on these mounting sides by thermocompression
Implementation Method 3
an opaque protective plate mounted on this mounting side above this sensor
Data Source
AI summary
An electronic device includes a substrate plate with a traversing passage. An electronic component, mounted to the substrate plate, includes an integrated circuit chip with an optical sensor and an opaque protective plate mounted above the sensor. The electronic component is mounted with the chip facing the substrate plate such that the protective plate is engaged with the traversing passage. Electrical connection elements extend between the chip and the substrate plate. An internal block of encapsulation material extends into the traversing passage of the substrate plate between the chip and the substrate plate so as to embed the electrical connection elements.