Optical Sensor Coating Recess for Resin Adhesion Stability

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Solution Overview

Problem

Existing optical element devices, such as optical sensors, face issues with the transparent sealing resin stripping off from the coating layer due to differences in thermal expansion coefficients, leading to gaps and changes in light detection characteristics.

Innovation Solution

The optical element device incorporates a recess on the coating layer surface, filled with transparent sealing resin, which improves adhesion and tightness between the resin and the coating layer, preventing stripping and maintaining light detection accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If transparent sealing resin is used to seal the semiconductor substrate and coating layer, then the optical element device is protected and sealed, but the resin strips off from the coating layer due to thermal expansion coefficient differences

Engineering Contradiction:
Improvesealing performanceVSAvoidadhesion strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The invention transitions from a planar sealing interface to a three-dimensional recess structure. The recess formed on the coating layer surface creates vertical walls that extend into the sealing resin, adding a depth dimension to the adhesion interface. This dimensional change increases the bonding area and creates mechanical interlocking, preventing resin stripping while maintaining reliable sealing performance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Strength

If a recess is formed on the coating layer surface to improve adhesion, then resin stripping is prevented, but the light receiving portion may be hindered

Engineering Contradiction:
Improveadhesion strengthVSAvoidlight reception interference
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The recess is strategically positioned in a localized area of the coating layer that does not interfere with the light receiving portion's optical path. By concentrating the adhesion-enhancing structure in a specific location away from the active light detection area, the invention achieves improved resin bonding without compromising light reception performance. Different regions of the coating layer serve different functions: light reception in one area and mechanical bonding in another.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The recess enhances the adhesion between the transparent sealing resin and the coating layer, ensuring consistent light detection without hindering the light receiving portion, thus maintaining the optical element's performance and preventing resin stripping.

Implementation Method 1

The transparent sealing resin 6 fills a recess h formed on a second coating layer surface 5s2. Consequently, tightness between the transparent sealing resin 6 and the coating layer 5 is improved, and peeling of the transparent sealing resin 6 from the coating layer 5 can be prevented.

Methodology Applied
Scientific EffectMechanical interlocking:

Implementation Method 2

a semiconductor substrate, having a light receiving portion

Methodology Applied
Scientific EffectPhotoelectric effect: Photoelectric Effect

Data Source

PatentUS20240243208A1Optical element device
Publication Date: 2024.07.18 ROHM CO LTD
  • US20240243208A1 patent drawing
  • US20240243208A1 patent drawing
  • US20240243208A1 patent drawing

AI summary

The present disclosure provides an optical element device. The optical element device includes: a semiconductor substrate, having a light receiving portion; a coating layer, covering the light receiving portion; and a transparent sealing resin, sealing the semiconductor substrate and the coating layer. The coating layer has a first coating layer surface facing the semiconductor substrate and a second coating layer surface located opposite to the first coating layer surface. The coating layer has a recess formed on the second coating layer surface. The transparent sealing resin contacts at least a portion of an inner peripheral surface of the recess.