Optical Sensor Module EMI Shielding via Conductive Molded Cap
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Optical sensor modules face challenges with electromagnetic interference (EMI) issues between the module and other electronic devices, which can affect their performance and require additional shielding that increases the module's footprint and production complexity.
Innovation Solution
The optical sensor module incorporates a molded cap made of a material with electrically conductive particles for EMI shielding, along with conductive traces in cover glasses and conductive leads, to manage electromagnetic interference without increasing the module's size or complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional non-conductive cap materials are used, then the module structure is simple and production is easy, but electromagnetic interference shielding is insufficient
Solution Approach 1:
The cap is constructed using a composite material system consisting of a base material (metal or plastic) combined with conductive layers or conductive particles. This composite structure provides effective EMI shielding while maintaining manufacturing feasibility. The conductive elements are integrated into the cap structure through various methods such as coating, embedding, or plating, creating a multi-functional component that addresses both shielding and structural requirements.
Solution Approach 2:
The patent modifies the electrical conductivity parameter of the cap material by introducing conductive elements. This parameter change transforms the cap from a non-conductive component to one with controlled electrical conductivity, enabling EMI shielding functionality. The conductivity can be adjusted by varying the type, amount, and distribution of conductive particles or layers, allowing optimization of shielding effectiveness.
2Object-affected harmful factors
If additional EMI shielding components are added, then electromagnetic interference shielding is improved, but the module footprint increases
Solution Approach 1:
The EMI shielding function is merged with the existing cap component rather than adding a separate shielding element. The cap simultaneously serves as a protective cover and an EMI shield by incorporating conductive materials into its structure. This integration eliminates the need for additional shielding components, maintaining the module's compact footprint while providing effective electromagnetic interference protection.
Solution Approach 2:
The cap is designed to perform multiple functions: mechanical protection of internal components, structural support, and electromagnetic interference shielding. By making the cap multi-functional, the patent eliminates the need for separate dedicated shielding components, thereby avoiding increased module footprint while achieving comprehensive EMI protection.
3Object-affected harmful factors
If additional EMI shielding components are added, then electromagnetic interference shielding is improved, but production complexity increases
Solution Approach 1:
The EMI shielding functionality is combined with the cap manufacturing process itself, rather than requiring separate assembly steps for adding shielding components. Conductive materials are integrated into the cap during formation through methods such as injection molding with conductive compounds, coating processes, or plating operations. This integration simplifies production by reducing the number of manufacturing steps and assembly operations required.
Solution Approach 2:
The conductive elements are incorporated into the cap structure during the cap manufacturing process itself, before the cap is assembled to the module. This preliminary action ensures that the shielding capability is built-in from the start, eliminating subsequent assembly steps and reducing overall production complexity. The cap is produced with its shielding functionality already integrated, streamlining the manufacturing workflow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively shields against electromagnetic interference, improving the module's performance and reliability while maintaining a compact design and simplifying production processes.
Implementation Method 1
the molded cap being formed of a molding material comprising electrically conductive particles dispersed therein for providing electromagnetic interference shielding
Implementation Method 2
conductive leads assembled with, or included in, the module cap and coupled to first conductive pads of the substrate
Data Source
AI summary
The present disclosure provides an optical sensor module. An example optical sensor module includes a light-emitting device; a light-receiving sensor; and a module cap adapted to at least partially cover the light-emitting device and the light-receiving sensor, the module cap being a molded cap, the molded cap being formed of a molding material comprising electrically conductive particles dispersed therein for providing electromagnetic interference shielding.