Optical Sensor EMI Shield Layout for Compact Crosstalk Isolation
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Solution Overview
Problem
Conventional EMI shielding methods for optical sensors face challenges such as increased component and assembly costs, larger footprints due to rounded corners, gaps leading to reduced shielding effectiveness, especially at higher frequencies, and internal cross-talk between electrical components.
Innovation Solution
The use of localized conductive envelopments formed by EMI shields with protrusions and apertures around electrical components, coupled with a lens, provides effective shielding while reducing material and assembly costs, and maintaining space efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional stamping fabrication techniques are used to create EMI shields, then the manufacturing process is simple and cost-effective, but the shields cannot form sharp corners resulting in larger footprint
Solution Approach 1:
The patent divides the EMI shield into multiple segments or sections, each capable of forming sharp corners independently. This segmentation allows the shield to achieve a compact footprint with right-angle corners while maintaining compatibility with stamping fabrication processes for each segment.
Solution Approach 2:
The patent transitions from two-dimensional flat EMI shields to three-dimensional structures with vertical walls and sharp corners. This dimensional change enables the shield to enclose components more effectively while reducing the horizontal footprint, overcoming the limitation of conventional stamping techniques.
2Area of stationary object
If multiple metal cans are used to reduce EMI shield footprint, then the footprint is reduced, but gaps are introduced that allow EM waves to leak
Solution Approach 1:
The patent merges multiple EMI shield sections into a unified structure with interlocking features. The protrusions and recesses of adjacent sections connect to form continuous conductive surfaces, eliminating gaps between separate metal cans while maintaining the reduced footprint.
Solution Approach 2:
The patent employs nested or interlocking geometries where one EMI shield section fits within or alongside another. This nesting approach ensures tight integration between multiple sections, preventing EM wave leakage through gaps while achieving compact dimensions.
3Object-affected harmful factors
If package-level EMI shielding is implemented, then EMI protection is provided, but material and assembly costs increase
Solution Approach 1:
The patent designs the EMI shield to serve multiple functions: providing electromagnetic shielding, supporting optical components via integrated mounts, and facilitating thermal management. This multi-functionality eliminates the need for separate components, reducing material and assembly costs while maintaining comprehensive EMI protection.
Solution Approach 2:
The patent combines the EMI shield with other package components into an integrated structure. By merging the shield with component mounts, housings, or thermal management features, the design reduces the total number of parts and assembly steps, thereby lowering manufacturing costs while preserving EMI shielding effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances EMI shielding performance, reduces material and assembly costs, and minimizes the likelihood of electromagnetic interference between components, while allowing optical functionalities to be maintained.
Implementation Method 1
EMI shielding creates a Faraday cage effect which attenuates radiation of electromagnetic (EM) waves
Implementation Method 2
a lens coupled to the first EMI shield, wherein the lens is positioned above the first electrical component
Data Source
AI summary
Methods, systems, and apparatuses for electromagnetic interference (EMI) shielding are provided. An apparatus comprises a plurality of electrical components coupled to a substrate. The plurality of electrical components comprises a first electrical component coupled to a first region of the substrate and at least one other electrical component coupled to at least one other region of the substrate. The first electrical component is configured to emit electromagnetic waves. The apparatus also comprises an EMI shield forming a conductive envelopment around the first region. The first electrical component is inside the conductive envelopment and the one other electrical component is outside of the conductive envelopment. The EMI shield comprises an aperture positioned above the first electrical component. The apparatus further comprises a lens coupled to the EMI shield. The lens is positioned above the first electrical component and is substantially aligned with the aperture.