Optical Sensor Packaging With Integrated Filter and Light Masking
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Solution Overview
Problem
Existing photoelectric sensors are limited in miniaturization due to their structural design, which includes a chip and a light source bonded with metal wires and covered by a cover with a gap for an optical filter, hindering size reduction without compromising optical performance.
Innovation Solution
An optical sensor device with a light-emitting module, first and second structures, and a mask layer, where the light-emitting module includes a light exit region and photosensitive member, and the mask layer exposes these components while integrating an optical filter layer, embedded in a plastic encapsulation layer with thin-film wires, reducing overall thickness and size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the optical filter is provided on the cover with a gap between the light source and the optical filter, then the optical performance can be maintained, but the device size cannot be reduced
Solution Approach 1:
The optical filter layer is integrated directly onto the driver chip surface, merging the filter function with the chip structure. This eliminates the separate cover and gap structure, reducing device volume while maintaining optical performance through direct integration of the filter at the chip level
Solution Approach 2:
The optical filter is transitioned from a planar element on a cover to a layered structure integrated on the chip surface. The mask layer is positioned at a different depth level (z-dimension) to expose specific regions while maintaining compact lateral dimensions, enabling size reduction without compromising optical functionality
2Object-affected harmful factors
If the mask layer is used to expose the light exit region and photosensitive member, then external light interference is shielded, but the structural complexity increases
Solution Approach 1:
The mask layer is selectively patterned to expose only specific regions (light exit region and photosensitive member) while covering other areas. This localized approach provides targeted shielding against external light interference without requiring a complete structural redesign, balancing protection needs with structural simplicity
Solution Approach 2:
The mask layer serves multiple functions simultaneously: it acts as a shielding layer against external light, defines the optical aperture, and integrates with the driver chip structure. This multi-functionality reduces the need for separate components, thereby reducing overall structural complexity despite the added shielding capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optical sensor device achieves reduced size without compromising optical performance by integrating the optical filter into the driver chip and using thin-film wires, resulting in a thickness of less than 400 μm and improved optical performance by shielding from external light interference.
Implementation Method 1
an optical filter layer, wherein the light exit region and the photosensitive member are both located on a side of the light-emitting module close to the first structure, the first structure exposes the light exit region and the photosensitive member
Implementation Method 2
a chip, which is detection of light signal and a light source
Data Source
AI summary
An optical sensor device is disclosed. The optical sensor device includes a light-emitting module, a first structure, a second structure and a mask layer, the first and second structures are formed on opposing ends of light-emitting module and cover portions of light-emitting module, the light-emitting module includes a light exit region, a photosensitive member and an optical filter layer, the light exit region and photosensitive member are both located on a side of light-emitting module close to first structure, the first structure exposes light exit region and photosensitive member, the optical filter layer wraps exposed portion of photosensitive member, the mask layer is arranged on first structure and surface of light-emitting module facing first structure, and the mask layer exposes light exit region and photosensitive member, avoiding influence of external light on optical sensor device through mask layer, so as to improve optical performance of optical sensor device.