Optical Sensor Frame Structure with Partition Wall
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Solution Overview
Problem
Optical sensor modules face issues with light leakage causing dark current interference and insufficient combining strength between the housing and lead frame, leading to noise and malfunction.
Innovation Solution
A frame structure with a first and second frame set, including chip-mounting and wiring frames with conductive leads and indentations, and a housing with separate compartments and a partition wall, enhances combining strength and reduces interference by preventing light leakage and creating a tortuous moisture path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the housing and lead frame are combined with simple structure, then manufacturing is easy, but combining strength is insufficient causing peeling
Solution Approach 1:
The patent applies curvature by forming the partition wall with a bent shape including a first bent portion and a second bent portion. This curved structure increases the combining strength between the housing and lead frame while preventing peeling, resolving the contradiction between simple manufacturing and strong bonding.
2Volume of moving object
If light emitting element and optical sensor are placed close together, then device size is reduced, but light leakage causes dark current interference
Solution Approach 1:
The patent divides the housing into a first housing portion and a second housing portion with a partition wall between them. This segmentation prevents light leakage from the light emitting element to the optical sensor, eliminating dark current interference while maintaining compact device size.
Solution Approach 2:
The patent applies local quality by creating a light-shielding partition wall in the specific region between the light emitting element and optical sensor. This localized light blocking structure prevents interference without affecting other parts of the device, allowing close placement of components.
3Device complexity
If housing structure is simplified, then manufacturing complexity is reduced, but moisture-proof ability is insufficient
Solution Approach 1:
The patent forms the partition wall with bent portions that create a tortuous path for moisture. This curved structure enhances moisture-proof ability while maintaining relatively simple manufacturing, resolving the contradiction between structural simplicity and moisture protection.
Data Source
AI summary
An optical sensor module includes a first frame set, a second frame set and a housing which partially covers the first frame set and the second frame set. The first frame set has a first chip-mounting frame and a first wiring frame. The first chip-mounting frame has a first chip-mounting section, and a first conductive lead. At least one first indentation is formed on the first chip-mounting section. The second frame set has a second chip-mounting frame and a second wiring frame. The second chip-mounting frame has a second chip-mounting section and a second conductive lead. At least one second indentation is formed on the second chip-mounting section.