Optical Sensor Package Layout for Strong Magnetic Attachment
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Solution Overview
Problem
Wearable electronic devices face challenges in achieving both compact size and strong magnetic attachment for wireless charging due to the need to position magnets away from optical sensors, which reduces magnetic field strength.
Innovation Solution
Integration of a permanent magnet with optical sensor components in a matrix material within the device, allowing for a smaller magnet to be used closer to the device's surface while maintaining magnetic attachment strength, and using redistribution layers for interconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the magnet is positioned away from the optical sensor to protect the sensor, then the optical sensor has direct access to the object, but the magnetic field strength at the device surface is reduced
Solution Approach 1:
The patent combines the optical sensor package and magnet into a single integrated assembly where the sensor is positioned at the front surface for direct optical access, while the magnet is positioned at the rear surface for strong magnetic attachment, eliminating the need to choose between sensor protection and magnetic field strength
Solution Approach 2:
The patent transitions from a planar arrangement where the magnet would block optical access to a three-dimensional arrangement with the sensor at the front and magnet at the rear, allowing both functions to operate independently without interference
2Volume of moving object
If the device size is reduced for compact wearability, then the device can be worn comfortably, but the magnetic attachment strength is reduced due to smaller magnet size
Solution Approach 1:
The patent merges the optical sensor package with the magnet into a single integrated assembly, allowing the magnet to be positioned at the rear surface where it can maintain sufficient size for strong magnetic attachment while the overall device remains compact for comfortable wearability
3Force
If the magnet size is increased to improve magnetic attachment strength, then the magnetic field strength is improved, but the device size and complexity increase
Solution Approach 1:
The patent combines the optical sensor package and magnet into a single integrated assembly, allowing the magnet to be positioned at the rear surface where it can maintain sufficient size for strong magnetic attachment without increasing the overall device volume, as the sensor package occupies the front portion of the device
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a compact design with effective magnetic attachment for wireless charging and direct optical access for biometric sensing, enhancing packing efficiency and reducing component count.
Implementation Method 1
a permanent magnet positioned in the body structure and configured to generate a magnetic field for magnetically attaching the wearable electronic device to a docking device
Implementation Method 2
a light emitting diode positioned in the body structure and configured to emit light
Implementation Method 3
a photodiode positioned in the body structure and configured to detect the emitted light reflected from an external object
Data Source
AI summary
An integrated sensor package for an electronic device may include a matrix material defining a body structure of the integrated sensor package, a light emitting diode at least partially encapsulated in the matrix material, a photodiode at least partially encapsulated in the matrix material and configured to detect light emitted by the light emitting diode and reflected by an object external to the integrated sensor package, a via structure at least partially encapsulated in the matrix material, a permanent magnet at least partially encapsulated in the matrix material, a first conductive member on a first side of the integrated sensor package and conductively coupling the light emitting diode to a first end of the via structure, and a second conductive member on a second side of the integrated sensor package opposite the first side and conductively coupled to a second end of the via structure.