Optical Image Sensor Metallization Layers for Fingerprint Sensing
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Solution Overview
Problem
Fingerprint sensors integrated into electronic devices often require separate authentication steps, which can be inconvenient, especially when users want to perform authentication quickly while using the device for other tasks.
Innovation Solution
An electronic device with an optical image sensor featuring metallization layers with light transmissive collimation openings, a light source layer, and a transparent cover layer to enable efficient fingerprint sensing, allowing for simultaneous authentication during device usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If fingerprint sensor is integrated into electronic device, then authentication function is added, but authentication speed and user convenience deteriorate due to separate authentication steps
Solution Approach 1:
The patent combines the fingerprint sensor with the display screen by integrating the sensor into the display assembly, allowing the fingerprint authentication function to be merged with the display function. This enables users to authenticate by simply placing their finger on the display surface without needing to switch to a separate authentication interface, thereby reducing authentication time while maintaining versatility.
Solution Approach 2:
The display surface serves multiple functions: it acts as both the display screen and the fingerprint sensor activation surface. By making the display assembly multi-functional, the system eliminates the need for separate authentication steps, allowing users to perform authentication naturally during normal device usage without time loss.
2Measurement precision
If optical image sensor with metallization layers is used, then light transmission and sensing efficiency are improved, but device complexity increases
Solution Approach 1:
The patent incorporates metallization layers within the optical image sensor structure, adding a vertical dimension to light transmission control. These metallization layers are arranged in specific patterns to guide and collimate light through vertical openings, improving sensing precision without significantly increasing horizontal device footprint or overall structural complexity.
Solution Approach 2:
The metallization layers are nested within the optical image sensor structure, with multiple layers positioned at different depths. This nested arrangement allows complex light management functions to be achieved within a compact vertical space, improving sensing precision while maintaining device compactness and avoiding excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables quick and efficient fingerprint authentication without the need for separate steps, enhancing user convenience by integrating optical image sensing circuitry and light source layers for improved biometric data collection.
Implementation Method 1
The light source layer may include a plurality of spaced apart light emitting diodes
Implementation Method 2
The optical image sensing circuitry may include an array of photodiodes and readout circuitry coupled thereto
Implementation Method 3
Each layer may have at least one light transmissive collimation opening therein aligned with the optical image sensing circuitry
Data Source
AI summary
An electronic device may include an optical image sensor that includes optical image sensing circuitry and metallization layers above the optical image sensing circuitry. Each layer may have at least one light transmissive collimation opening therein aligned with the optical image sensing circuitry. The electronic device may also include a light source layer above the optical image sensor and a transparent cover layer above the light source layer defining a finger placement surface configured to receive a finger adjacent thereto.