Optical Sensor Module Cross-Talk Reduction via Capping Substrate
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional optical sensor modules suffer from cross-talk interference, which reduces their performance due to light received by the sensor that was not emitted from the light source and reflected from the intended object, leading to increased size, complexity, and cost in existing designs that attempt to mitigate this issue.
Innovation Solution
The optical sensor module design incorporates a capping substrate with penetrating holes and runners to house lenses or transmissive panels, isolating light emitting and sensing components within separate chambers, and utilizing light absorbing layers to minimize cross-talk, while eliminating the need for additional protective lids, thus reducing package size and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional optical sensor modules are designed to reduce cross-talk, then cross-talk reduction is achieved, but package size and manufacturing complexity increase
Solution Approach 1:
The module is divided into two isolated chambers: a first chamber housing the light emitting component and a second chamber housing the light sensing component. The capping substrate with penetrating holes and runners creates physical separation between these chambers, preventing light from directly traveling between them and thus reducing cross-talk while maintaining a compact integrated structure
Solution Approach 2:
Light absorbing layers are introduced as intermediary elements within the chambers to absorb stray light and prevent it from reaching the opposite component. These absorbing layers act as mediators that eliminate harmful light paths without requiring complex external shielding structures
2Object-affected harmful factors
If conventional optical sensor modules are designed to reduce cross-talk, then cross-talk reduction is achieved, but package size increases
Solution Approach 1:
The capping substrate with integrated penetrating holes and runners is nested within the compact module housing, creating a space-efficient structure. The chambers are arranged in a nested configuration where the light emitting component and light sensing component are positioned close together vertically, minimizing the overall package footprint while maintaining effective cross-talk isolation
Solution Approach 2:
The design transitions from horizontal light paths to vertical light paths by stacking the light emitting and sensing chambers one above the other. This dimensional change allows the components to be positioned in close proximity (reducing package size) while the capping substrate and light absorbing layers provide effective cross-talk isolation in the vertical dimension
3Object-affected harmful factors
If additional protective lids are added to reduce cross-talk, then cross-talk reduction is achieved, but manufacturing cost and complexity increase
Solution Approach 1:
The capping substrate integrates multiple functions into a single component: it serves as the protective lid, creates chamber isolation through penetrating holes, provides light absorption paths through runners, and houses both the light emitting and sensing components. This consolidation eliminates the need for separate protective lids and additional cross-talk mitigation components, reducing manufacturing steps and cost
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces cross-talk to less than 1% while maintaining a compact size, outperforming conventional modules in both cross-talk reduction and package size, achieving better performance with reduced manufacturing costs.
Implementation Method 1
a first lens or a first transmissive panel is formed or disposed in the first penetrating hole
Implementation Method 2
The optical sensor receives or senses light (generally infrared rays) emitted from the light source and reflected by an external object
Implementation Method 3
a second lens or a second transmissive panel is formed or disposed in the second penetrating hole
Implementation Method 4
utilizing light absorbing layers to minimize cross-talk
Data Source
AI summary
An optical sensor module includes: (1) a lid defining a first chamber and a second chamber isolated from the first chamber; (2) a light emitting component disposed within the first chamber; and (3) a light sensing component disposed within the second chamber; wherein the lid includes a capping substrate and a top of the first chamber and a top of the second chamber are demarcated by the capping substrate, wherein the capping substrate defines a first penetrating hole at the top of the first chamber and a first runner connecting a side wall of the first penetrating hole, and wherein a first lens or a first transmissive panel is formed or disposed in the first penetrating hole and has an extension formed or disposed in the first runner connecting the side wall of the first penetrating hole.