Optical Sensor Module EMI Shielding via Metal Casing
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Solution Overview
Problem
Existing optical sensor modules face challenges with electromagnetic interference (EMI) issues, which can affect their performance and require additional shielding that increases the module's footprint and production costs.
Innovation Solution
The optical sensor module incorporates a metal casing with a molded part made of a conductive molding material, which provides EMI shielding without increasing the module's size. The metal casing is electrically coupled to the ground through a substrate, enhancing the EMI protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional EMI shielding components are added to the optical sensor module, then EMI protection is improved, but the module's footprint and production costs increase
Solution Approach 1:
The patent combines the EMI shielding function with the existing module cap structure by integrating a metal layer into the cap. This merging of functions allows the cap to simultaneously serve as both a structural component and an EMI shield, eliminating the need for separate shielding components and thereby maintaining compact module dimensions while providing effective EMI protection.
Solution Approach 2:
The module cap is designed to perform multiple functions: it provides structural support, defines the optical aperture, and simultaneously acts as an EMI shield through the integrated metal layer. This multi-functionality approach allows a single component to address multiple requirements, including EMI protection, without increasing the overall module footprint or requiring additional dedicated shielding elements.
2Reliability
If additional EMI shielding components are added to the optical sensor module, then EMI protection is improved, but production complexity and costs increase
Solution Approach 1:
By merging the EMI shielding function into the module cap structure through an integrated metal layer, the patent reduces the total number of discrete components that need to be handled during assembly. This integration simplifies the manufacturing process by reducing the number of assembly steps, handling operations, and quality checks required, thereby lowering production complexity and costs while maintaining effective EMI protection.
Solution Approach 2:
The module cap employs a composite structure combining a base material (such as plastic or ceramic) with an integrated metal layer. This composite material approach allows the EMI shielding functionality to be incorporated during the cap's manufacturing process itself, rather than requiring separate assembly steps for adding shielding materials. The composite structure can be produced in a single manufacturing operation, significantly simplifying production compared to assembling multiple separate components.
3Reliability
If a metal casing is used for EMI shielding, then EMI protection is improved, but the module size increases
Solution Approach 1:
The metal EMI shielding layer is nested within or integrated into the existing module cap structure rather than being added as an external component. This nesting approach allows the shielding function to be embedded within the volume already allocated for the cap, utilizing existing structural space efficiently. The metal layer is incorporated during cap manufacturing or as an integral part of the cap design, ensuring that the overall module volume remains unchanged while providing effective EMI protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively addresses EMI issues while maintaining a compact module design, reducing production complexity, and ensuring uniform EMI shielding performance.
Implementation Method 1
the metal of the metal casing is selected to reflect and/or absorb electromagnetic waves
Implementation Method 2
the metal of the metal casing is selected to reflect and/or absorb electromagnetic waves
Implementation Method 3
the molded part is made of a molding material which is electrically conductive
Implementation Method 4
the light-emitting device emits a light signal through the first opening
Data Source
AI summary
The present disclosure provides an optical sensor module. An example optical sensor module comprises: a light-emitting device; a light-receiving sensor; and a module cap adapted to at least partially cover the light-emitting device and the light-receiving sensor, the module cap comprising a metal casing and a molded part made of a molding material lining the inside surfaces of the metal casing.